Used PERKIN ELMER 4400 #9224800 for sale

PERKIN ELMER 4400
Manufacturer
PERKIN ELMER
Model
4400
ID: 9224800
Sputtering system Does not include: Targets Pumps Power supply.
PERKIN ELMER 4400 is a sputtering equipment that is widely used in the semiconductor industry for the deposition of thin films of conductive material. It consists of a vacuum chamber, an RF high frequency generator, a sputter cathode and a target. The chamber is filled with an inert gas, typically argon, and allows for a vacuum level up to 10-6 mbar. To sputter, the RF generator converts AC input current into a high-frequency RF field which is applied to the sputter cathode. The electrons accelerate towards the target substrate and upon impact, they cause erosion of the material of the target. This provides a clean and homogenous deposition of material on the substrate. 4400 sputtering system can deposit in single layer or multiple layers, with deposition rates from 0.1nm to 12,000nm/min, depending on the process parameters. It can deposit materials such as oxides, nitrides, carbides and metals, and allows adjustment of the sputter rate and the ion composition for control of the film thickness, uniformity and composition. It can achieve minimum film thickness ranges of 5-500nm. A vacuum chamber with a 4 inch circular target is usually provided with PERKIN ELMER 4400 sputtering unit and allows for the use of 4-inch wafers. 4400 sputtering machine has a variety of features that make it a convenient choice for the deposition of thin films. It is equipped with several safety features, such as a gas flow monitor, a pressure indicator and a temperature indicator. The tool is also equipped with an advanced power source that enables the user to precisely control the power, allowing for the accurate adjustment of the deposition rate. Additionally, a graphical user interface (GUI) allows the user to quickly and easily monitor and control process parameters such as chamber pressure, sputter rates and target voltage. PERKIN ELMER 4400 sputtering asset is a reliable and efficient choice for depositing thin films in the semiconductor industry. It is easy to operate and maintain, and offers a wide range of benefits for users, making it an ideal choice for many sputtering applications.
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