Used PERKIN ELMER 4400 #9355617 for sale
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ID: 9355617
Sputtering system
(3) Round targets, 8"
With RF etch
CTI On board (8) cryopump with fast regen controller
ADVANCED ENERGY RFG 1250 RF Power supply
ADVANCED ENERGY RFG / AZX RF Controller
GRANVILLE PHILLIPS 307 Ion gauge controller
MKS 270 Signal controller.
PERKIN ELMER 4400 is a sputtering equipment designed for film deposition in research and industrial applications. This equipment is built with a host of features and technologies that allow it to process substrates quickly and efficiently. The pulse-reverse magnetron sputtering technology employed in 4400 is a versatile and reliable process for producing thin films and enhancing adhesion on the substrate. Duty cycles can be quickly and accurately adjusted depending on the set parameters, ensuring consistent film growth. The system also allows for a multi-target configuration, which can be a major advantage for mass production lines. PERKIN ELMER 4400 is also engineered with a robust power supply, allowing for the precise control of the RF power levels required for various film deposition techniques. This ensures uniformity and consistency of the films regardless of target conditions. 4400 ensures a clean working environment with its innovative vacuum unit. It is designed with a multi-stage pumping machine, including an Edwards 40 XDS Dry Scroll pumps and an Exhaust Systems 150 Dry Vacuum Pump, that allow for rapid evacuation of the deposition chamber and and tool exhaust. In addition, PERKIN ELMER 4400 is equipped with an in-line oil separator to prevent oil pollution. The range of available substrate sizes and configurations is also expanded with 4400 as it can accommodate wafer sizes up to 8 inches (200 mm) in diameter. This provides greater flexibility to accommodate different substrates and the ability to process small runs. Overall, PERKIN ELMER 4400 provides precision, reliability, and productivity which has made it a choice find for a wide range of film deposition applications including medical devices, semiconductors, compound semiconductors and vacuum components for industry. This sputtering asset is designed to provide a straightforward approach to thinner film deposition with a streamlined process. It is also outfitted with a host of features and technologies that ensures it is up to the toughest tasks.
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