Used PERKIN ELMER 4450 #9190161 for sale

Manufacturer
PERKIN ELMER
Model
4450
ID: 9190161
Sputtering system (4) Target systems Round target, 8" RF Target (3) DC Targets Load lock pallet, 24" Data logging Recipe control Remote operation Color touch screen Jennings vacuum: 5kW Optical shutter position sensors Simplified sputter head design Industrial PC Water / Pneumatic distribution box Electro polished chambers VAT Throttling gate valve Keyboard Vexta precision table motor Controllers Oil free scroll type mechanical pump Color coded air N2 Water lines Mass flow controller Residual gas analyzer Quick disconnects Mounted rails for easy access Touchscreen display Process logic controller.
PERKIN ELMER 4450 is a high-end hydride sputtering system designed to deposit thin films of metal or alloys onto substrates in a controlled and uniform manner. It is commonly used in the manufacturing of semiconductors, magnetic devices, optics, and other electronic components. The system is made up of several components: a chamber, a substrate holder, a power supply, an evaporator, a shutter mechanism, and a radio frequency (RF) generator. The chamber is made up of two stainless steel walls and is sealed to retain a vacuum. The substrate holder is mounted on the chamber and is used to secure the substrate being treated. The power supply is used to provide a constant voltage and current to the chamber and support it during operation. The evaporator is used to vaporize the material to be sputtered onto the substrate. The shutter mechanism is used to control when material is vaporized. Lastly, the RF generator is used to provide a stream of electrons that deflects the vaporized material onto the substrate. Once the material is vaporized, the substrate holder is placed inside the chamber, and then a vacuum is created. The RF generator is used to create an electric field inside the chamber and generate an electron beam which causes the material to sputter off the surface of the substrate. This process is repeated hundreds of times until the desired thickness of the film has been reached. The advantage of using the sputtering technique is that it allows for the deposition of uniform layers of material onto the substrate, which can then be patterned or coated. Additionally, the process can be used to create high-performance, durable materials with excellent electrical, optical, and mechanical properties. 4450 can be used for many different applications, including the creation of high-quality semiconductor components, magnetic materials, optical mirrors, mirror coatings, memory devices, and more. Additionally, it can also be used for research and development purposes, as the system can generate more exact and uniformized layers with mixtures of different elements and compounds.
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