Used PERKIN ELMER 4450 #9262972 for sale
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PERKIN ELMER 4450 is an advanced ion-assisted sputtering equipment specifically designed for the deposition and characterization of films onto substrates. It is equipped with a wide range of sputtering sources for the deposition of virtually all metals, nanoparticles and other materials, as well as for reactive and oxidation processes. The system is designed to deposit thin films with uniform thickness and conformality onto challenging substrates, such as semiconductors and ceramics. Its advanced features, such as advanced ion control and process control unit, enable precise and accurate film deposition. Moreover, its advanced design also makes it possible to obtain high-quality, homogeneous films. The advanced ion control allows the unit to deliver and control consistent film composition and depth on a range of materials. Moreover, it features a rotating stage to move the substrate position in order to optimize deposition in order to achieve uniform film thickness on challenging or recessed substrates. It also boasts a process control unit for precise deposition control with an integrated load-lock chamber that allows for automatic substrate changes and quick material exchanges. The machine can be used in various fields of application, such as flat panel displays, solar cells, optoelectronic devices, data storage, and semiconductor wafers. Moreover, a wide range of sputtering processes, including neutrals, anodized films and reactive sputtering, can be conducted using the tool. This makes it ideal for rapid prototyping and characterization of many functional thin films in a variety of applications. In addition, the sputtering asset can be used for the deposition of ferroelectric and piezoelectric films. The model is also equipped with an advanced high-speed viewing equipment for the study of film deposition. Furthermore, it is an integrated software that allows for powerful analysis of the film deposition and characterization. Overall, 4450 is an advanced ion-assisted sputtering system designed for the deposition and characterization of films onto substrates. Its advanced features, such as advanced ion control and process control unit, enable higher-quality, homogeneous films to be deposited with uniform thickness and conformality onto challenging substrates. Moreover, its wide range of sputtering processes and powerful integrated software make it a great tool for rapid prototyping and characterization.
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