Used PERKIN ELMER ICP 5300DV #9224906 for sale

ID: 9224906
Sputtering system.
PERKIN ELMER ICP 5300DV is a state-of-the-art sputtering equipment used in materials processing and manufacturing industries. This machine is used in the deposition of thin film materials that are commonly used in the fabrication of various electronic, optoelectronic and photovoltaic devices. The sputtering system consists of a 6-axis robotic arm that is used to provide a high degree of sample uniformity and process uniformity. The sputtering unit is capable of depositing thin film layers with high precision and accuracy. The deposition rate can reach up to 0.02 nm/second with a low surface roughness. The machine employs multiple sputtering sources that can coat large substrates with uniform thickness and uniformity. It also includes a robotic arm for sample pickup and replacement. The sputtering tool is equipped with a gas and fluid control unit that provides gas with variable pressure and flow rates. This is important for ensuring uniform thin film depositions. The asset also incorporates an inert gas (argon) whoose flow can be controlled to reduce gas loss and prevent oxidation of the substrate. ICP 5300DV model is a very versatile equipment, offering a range of process capabilities such as high-rate evaporation, ion sputter etching, and deposition of thin films with an adjustable gas pressure range of 0.01-20 Torr. It also includes a power supply capable of providing an adjustable voltage output of up to 5,000 volts and a maximum power of 5,000 watts. One of the most important factors to consider when using PERKIN ELMER ICP 5300DV is the safety practices. This system features safety features such as an emergency stop button, an automated emergency shut off and an inert gas housing design that eliminates potential fire and explosion risks. It also includes a booth to contain any escaping gases and particles from the evaporative process. Overall, ICP 5300DV is a reliable sputtering unit with excellent capabilities for depositing thin film layers. Its features provide process flexibility, user-friendly controls and a safe, clean and efficient environment for materials processing.
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