Used PERKIN ELMER ICP 5300DV #9392687 for sale

PERKIN ELMER ICP 5300DV is a high-performance sputtering equipment designed to deposit thin film coatings onto substrates. It is an advanced system that combines precision sputtering with controlled deposition, offering a high deposition rate with excellent film properties for a wide range of applications. The unit consists of a sputtering chamber, an base as and a vacuum pumping station. The sputtering chamber is equipped with several magnets which produce an intense magnetic field, facilitating the ionization of the target material in the chamber. A gas injection machine is then used to introduce sputtering gas into the chamber. The baseplate contains the workpiece and is usually heated to the desired deposition temperature. The temperature, pressure, and power can be controlled and monitored in the chamber. Once the chamber is filled with the desired gases, a bipolar voltage is applied to the target. Ions from the gas are then accelerated towards the target, causing a bombardment of atoms which is known as 'sputtering'. The sputtered atoms then penetrate the substrate to form a thin film coating. ICP 5300DV is also equipped with a special pulsed power supply which allows for a controlled and uniform deposition of the material. The power supply can be programmed to vary the voltage and current during the sputter process which helps to ensure a uniform and high-quality coating. The tool also enables the operator to adjust the sputter rate, allowing for better control of the thickness of the deposited film. The asset is capable of depositing a wide range of materials from a variety of sources, including metals, non-metals, compounds, and alloys. The deposition rate is adjustable from a few nanometers per minute up to tens of microns per minute and can be used for research, prototyping, and production applications. Overall, PERKIN ELMER ICP 5300DV is an advanced sputtering model that can be used to apply high-quality thin films to a range of substrates. The equipment offers exceptional control over the process parameters and can be used to deposit various materials at a range of deposition rates.