Used PERKIN ELMER / RANDEX 3140 #9247279 for sale

PERKIN ELMER / RANDEX 3140 Sputtering Equipment is a high-quality sputtering system designed to deposit thin films of desired material onto substrates. It is a dual-magnetron unit which promotes more control over sputter deposition and is ideal for applications that require precision, such as coating optical components, lab-on-a-chip devices, data storage, displays, and materials analysis. RANDEX 3140 model features a 13 inch diameter vacuum chamber, making it suitable for a wide variety of substrates up to 12 inches in size. PERKIN ELMER 3140 also offers a wide range of operating pressure and deposition rates. It is capable of producing high-quality films with good adhesion, homogeneity, and uniformity at high deposition rates, ideal for thin-film deposition with plasma-enhanced chemical vapor deposition, reactive sputter deposition, or physical vapor deposition techniques. The machine is powered by a high-precision controller and provides precise optimization of the DC and RF power, RF frequency, and sputtering pressure for uniform thin-film deposition. 3140 also features a large variety of operating parameters, allowing the user to customize the deposition process and optimize the target properties of the finished film. In addition, PERKIN ELMER / RANDEX 3140 also includes an automatic wafer-handling tool for convenience and accuracy during the spinting process. It includes adjustable safety features, such as sensors and shut-off systems which will stop the sputter if a wafer is present in the chamber. RANDEX 3140 also comes with an electric infrared heating element for out-gassing substrates and initiating sputtering processes. PERKIN ELMER 3140 Sputtering Asset is an excellent tool for depositing thin films of desired materials onto substrates. It is a high-quality, integrated sputtering model that provides precise adjustable parameters and features, ensuring the success of thin-film deposition applications. The easy-to-use controller, intuitive safety features, and automatic wafer-handling equipment offer superior control over deposition parameters, allowing the user to create high-quality films with excellent adhesion, homogeneity, and uniformity.