Used RPT RTA-381A #9397130 for sale

RPT RTA-381A Sputtering Equipment is a high-precision, ultra-low-pressure sputtering system designed for evenly and uniformly depositing thin film coatings onto semiconductor substrates. The unit is composed of an RF power supply, chamber, sputter targets and gas delivery components, designed to be used in a range of scientific and industrial applications. The RF power supply is a highly programmable step-regulated external-RF generator with digital control for precise pulse-width modulation. It is capable of generating up to 400 watts of RF power at 13.56 MHz, depending on the vacuum configuration. This is capable of depositing films to a precise thickness, within +/−2%. The sputtering chamber is constructed from stainless steel, designed with ultra-high-vacuum (UHV) capability to maintain full vacuum levels when sputtering. It has an optimized design to ensure uniform deposition of films, with highly efficient vacuum pump systems that prevent outgassing. The sputter targets are composed of pure metals or alloys to ensure precise deposition materials. Wide range of sputter targets are available to meet the requirements for specific films, including sputter-etch targets for isolating layer transfer. The gas delivery components for the machine include a high-performance pneumatic vacuum valve, gas-mixer, and a digital mass-flow-controller (MFC). The MFC is highly informative and accurate, and designed to monitor the precise gas flows and to reduce the possibility of outgassing. RTA-381A offers precise, reliable, and highly repeatable thin film deposition for both scientific and industrial applications. It is capable of manufacturing various types of ultra-thin, high discrete layers of uniform thickness, within tight tolerances, with an optimized process control tool offering stability and repeatability. The asset is ideal for producing thin films of metals, again, alloys, and dielectric materials for a range of semiconductor devices.