Used SEMIQS Ti-Cu #9382375 for sale

SEMIQS Ti-Cu
Manufacturer
SEMIQS
Model
Ti-Cu
ID: 9382375
Sputter system.
SEMIQS Ti-Cu (titanium-copper) is a sputtering equipment designed for advanced nano-scale thin film deposition. The system is designed to deposit advanced metallic, semiconducting and dielectric thin films with a level of precision and process control previously unattainable. It is capable of sputter-depositing titanium, copper, tungsten, chromium, and other materials. Ti-Cu configuration is based on a planar cathode magnetron sputtering unit with an inert Cathode sputtering- Cathode spot coating. It includes one vacuum chamber, a power supply and a shielded cathode. The simplified design and integration results in a cost-effective machine that provides superior quality thin-film deposition. The tool is optimized for sputtering of titanium and copper with an adjustable energy level, achieved by using an external magnetic field. SEMIQS Ti-Cu sputter target is mounted on a rotating carousel, allowing easy and consistent film deposition from each target. The asset is capable of depositing ultra-thin films with a thickness up to 50nm at a rate up to 20nm/s. The model includes an advanced control equipment enabling precise rate control, uniformity control, and stability control when depositing thin films. Additionally, the system includes a high-end thermal controller to maintain a stable temperature in the vacuum chamber. Ti-Cu offers users the ability to accurately deposit titanium and copper at a repeatable rate and uniformity. This unit is ideal for scientific research and industrial applications including nano-scale thin film deposition, electronic device fabrication, and MEMS manufacturing. Additionally, the cost-efficient machine is also well suited for development projects such as capacitor and resistor fabrication, as well as other optics either for academic or industrial purposes. In conclusion, SEMIQS Ti-Cu is an advanced sputtering tool designed to provide precision and process control not previously available. Its ability to deposit ultra-thin films with accuracy and repeatability makes it a perfect fit for many industrial and scientific research projects, including advanced electronic device fabrication.
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