Used SHINCRON BSC-19043LT #293608265 for sale

SHINCRON BSC-19043LT is a dual-chamber sputtering equipment used in various industrial and scientific research applications. It consists of two deposition chambers mounted on the same axis with a transfer rotation arm separating the chambers. Vacuum tight seals are placed between the chambers to allow for high vacuum levels and repeatable process conditions. The system can handle up to six substrates in each chamber, and can be tailored to support a variety of substrate sizes and thicknesses. BSC-19043LT depositions up to four species of material simultaneously. A unique feature of this unit is its capability to configure material deposition sequences into sequences for two or three materials, or even sequential layers of a single material. SHINCRON BSC-19043LT features a proprietary ionized design with superior uniformity of the deposited film across the surface of the substrate. This superior uniformity is attributed to the adjustable and dynamic by-product suppression that this sputtering machine utilizes. The ionized design and dynamic by-product suppression also lead to improved process control over the deposition parameters. For ease of operation and safety, BSC-19043LT is equipped with safety interlocks that protect the operator and the tool from hazardous operations. The HEPA filter located between the chambers facilitates efficient pumping of contaminants. In addition, the asset is easily maintained with a variety of preventive maintenance options such as tube cleaning, wafer baking, and fountain maintenance. SHINCRON BSC-19043LT also provides unparalleled control over the deposition process. Through the use of advanced control technology, the model uses pressure and temperature sensors to precisely regulate the gas flow, pressure, and other key process parameters. This finely tuned control results in higher yield and improved film uniformity while reducing process runs. In the end, BSC-19043LT is an advanced dual-chamber sputtering equipment capable of handling a variety of substrates and materials with superior uniformity. Combining all the features and capabilities of this system, it is an ideal choice for materials research and deposition applications.