Used SPI 11430 #9200405 for sale

SPI 11430 sputtering equipment is a powerful and versatile vacuum-based coating system for a variety of applications. The unit is built to provide an unparalleled level of control over the deposition of thin films and nanofilms on production-line substrates. It is able to deposit films from metals, alloys, polymers and dielectrics with exceptional accuracy and repeatability. 11430 is a fully modularized, multi-chamber design, enabling its users to perform large-area, sequential sputtering of a wide range of materials in a single step. The unit contains up to four magnetrons mounted to a tombstone with adjustable positions, allowing for maximum flexibility in multi-layer applications. It is compatible with load-lock technology for short cycle times and high throughput. The machine is highly customizable. It is equipped with an array of process parameters, including temperature control, film thickness monitor, gas purging, sputter deposition rate, pumping speed, and sample temperature. This allows users to continuously adjust film characteristics depending on their specific needs for the job. In addition, the tool includes a precision main display with a user-friendly control interface which is designed to minimize set up time and maximize downtime. SPI 11430 is also equipped with an advanced deposition control asset which offers a wide range of operating parameters and recipes. This model is optimized for a wide range of materials, allowing for high process accuracy and repeatability. Additionally, 11430 equipped with an automated cleaning cycle to maintain quality during multi-layer deposition. SPI 11430 delivers outstanding performance and reliability, allowing users to quickly and easily process a variety of applications. The equipment's flexibility, combined with its wide range of operating parameters, makes it a powerful and reliable tool for thin film and nanofilm deposition. It is an ideal tool for industries that require repeatable and controlled thin film deposition.