Used TEL / TOKYO ELECTRON / NEXX Apollo HP #9226608 for sale
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ID: 9226608
Wafer Size: 6"-8"
Vintage: 2010
Sputtering system, 6"-8"
Standard vacuum end effector
Thin wafer handling:
Bernoulli end effector, 8"-12"
Upgraded front end, 8"-12"
Boost shield kit
(2) Etch shield kits
Constant etch Pressure Strike (CPS)
Miscellaneous parts
Backside gas option:
6" Kit:
(2) ESC Non-removable rim (3) trays (2 sets of 3 trays)
(2) Ground plane assemblies
Etch elevator kit
(2) ESC Removable rims (3) trays (2 sets of 3 trays), 12"
Degas load lock
ICP Etch chamber with 8” cryo
Deposition chamber:
(5) MAGNETRON
Power supply: 20 kW
Cryo, 8”-10"
(2) Deposition chamber shields
(2) Etch chamber shields
B1 MAGNETRON for Ti
Ni Loop MAGNETRONS for Ni
(2) B1 MAGNETRON for AuSn
B1 MAGNETRON for Au
SECS / GEM Included
Upgraded G1 MAGNETRON from K11007977 to K11208192
Magnetic array for G1 cathode
G1 Spares
Fully water sealed MAGNETRON assembly
Etch chamber shields
Depostion chamber shields (Non RF Bias)
(2) ESC (3) Trays (3 trays/set), 6" in base system
ESC Size kit, 8":
Removable ESC trays, 8" (2 sets of 3 trays)
(2) Ground plane assemblies
Etch elevator kit
T-Cool size kit, 8":
T-Cool (3) trays, 8" (Two sets of (3) trays)
(2) Ground plane assemblies
Etch elevator kit
(3) T-Cool (3) trays/set, 8"
RF Bias / Stress control option
RF Bias compatible shields
2010 vintage.
TEL / TOKYO ELECTRON / NEXX Apollo HP is a high-performance sputtering equipment designed for advanced material deposition processes, such as the synthesis of high quality thin films or deposition of specialty materials. This sputtering system is made of a vacuum vessel, sputtering source, substrate stage, and vacuum pumps. The main features of the unit include a high degree of control over all sputtering parameters, a wide range of materials and target sizes as well as flexibility in substrate size and shape. The vacuum vessel is made of stainless steel and is sealed with an oil diffusion pump. The vessel is designed to accommodate up to three sputtering source chambers for multiple process configurations. The sputtering sources are designed to run independently and are arranged to simultaneously face the substrate stage. They are made of stainless steel, and are equipped with powerful RF or DC power supplies. The source design ensures uniform ion bombardment over the substrate surface and uniform film deposition. The substrate stage is designed to hold up to 12 substrates, which can be of various shapes, such as circles, squares and rectangles. The stage can be moved in two directions, and its tilt can also be adjusted for optimal film thickness uniformity. The stage is equipped with an easy-to-use micrometer-based XYZ motion stage adjustment machine, as well as auto-flush nozzles for cleaning and for controlling the slight vacuum pressure variations. The sputtering tool is powered by two high power vacuum pumps. These pumps eliminate the need for a separate vacuum gauge, and make it much easier to obtain optimal film quality. The pumps maintain a stable vacuum in the chamber and minimize the possibility of target or substrate contamination during the process. The pumps also ensure noise reduction and prevent undue gas mobility. TEL Apollo HP is a versatile, high-performance sputtering asset, which can be used for a wide variety of thin film deposition processes. With its extremely high degree of control, its flexibility in substrate size and shape, and its high-power vacuum pumps, the model guarantees excellent film deposition results.
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