Used TEL / TOKYO ELECTRON / NEXX Nexx #9207094 for sale
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ID: 9207094
Wafer Size: 12"
Sputtering system, 12"
Loadport type: Porta 300, 12"
EFEM Robot type: GENMARK GB7 (3L7S080297)
Degas
Tray type: T-cool
RF Generator: ICP
3155031-029C RF Match
(5) Magnetrons:
Magnetron types:
Ti (G1)
TiW(G1)
Cu (M4)
Cu (M4)
Cu (M4)
3152422-112V Magnetron power supply
MFC Type:
MFC1-Model: 1179A00422CR15V
MFC2-Model: 1179A22CR15V
EBARA A30W Dry pump
Cryo pump (etch chamber): CTI-8F cryo pump, p/n: 8116199G001
Cryo pump (dep chamber): CTI-10F cryo pump, p/n: 8116164G002
Cryo pump side (dep chamber): CTI-8F Cryo pump, p/n: 8116199G001
Ion gauge (etch chamber): 354005-YE-T
Baratron (etch chamber): 627BU5TDDIB
Ion gauge (dep chamber): 354005-YE-T
Baratron (dep chamber): 627BU5TDDIB.
TEL / TOKYO ELECTRON / NEXX Nexx TEL is a sputtering equipment designed for precision deposition of thin films in a number of different applications. It utilizes sophisticated algorithms and technologies to achieve high uniformity and sputtering rates on various types of substrates. TEL Nexx is equipped with a 2-point sputtering source, coverless substrates chuck, and a contactless technique for superhigh precision deposition. The first feature of NEXX Nexx sputtering system is its advanced sputter-pumping technology. This process is designed to maximize sputtering rate and uniformity. To do this, Nexx is equipped with a reactively coupled magnetron source. This state-of-the-art technology generates a negative ion beam which is then focused onto the substrate. As a result, uniform films are created even when depositing on large substrates. TOKYO ELECTRON Nexx also provides for high-resolution imaging, allowing it to further improve deposition uniformity. Another unique feature of this sputtering unit is its ability to create contactless deposition of thin films. By using a vacuum thermal gradient technique, TEL / TOKYO ELECTRON / NEXX Nexx is able to create uniform films on substrates without using direct contact. This process eliminates the need to apply a film to the substrate manually, reducing the potential for contamination. In addition, the temperature control of TEL Nexx is designed to maintain low-temperature substrates, allowing for superior film uniformity. NEXX Nexx also utilizes sophisticated algorithms which allow for process optimization and improved process stability. Customizable recipes are available which allow for selection of optimal parameters for cost and time reduction. Furthermore, Nexx supports a wide range of deposition techniques, allowing users to customize films for a variety of applications. In conclusion, TOKYO ELECTRON Nexx offers a state-of-the-art sputtering machine which provides superior deposition uniformity, speed, and precision. By combining advanced technologies with an intuitive user interface, TEL / TOKYO ELECTRON / NEXX Nexx is designed to ensure consistent results and meet the demands of today's sputtering technology requirements. Whether used for industrial or academic research, TEL Nexx is a powerful tool for precise thin film deposition.
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