Used TOUSIMIS Automegasamdri 916B #9164943 for sale

ID: 9164943
Automatic supercritical point dryer system, 5"-8" Includes: Wafers, 2"-8" Chamber size: 8.5" x 1.25" deep Volume: 1162ml Temperature range: -30C to 60C Pressure range: 0-2000psi Viewing port Power: 120V
TOUSIMIS Automegasamdri 916B is a compact, high-performance sputtering equipment that is well-suited for applications in thin film deposition. It is equipped with a high-power DC magnetron sputter source that can generate highly uniform film deposition over large sample sizes. The sputter source is also equipped with a magnetic field programmed shutter system, which allows for rapid and repeatable patterning of the substrate without the need for a physical mask. The magnetron source is capable of running multiple sputter processes simultaneously, and is compatible with most gas-shielded cathodes. Automegasamdri 916B also features a remote control unit that can be programmed for automatic control. Through this machine, users can easily monitor and adjust deposition parameters such as target bias voltage, gas flow, and sputter time. The tool can also be operated remotely and is equipped with a robust safety asset to protect the operator and the equipment during operation. In addition to the powerful sputter source, TOUSIMIS Automegasamdri 916B is equipped with an advanced substrate transfer model. This equipment provides fast and accurate substrate positioning in order to optimize sputtering in terms of thickness, uniformity, adhesion, and etch rate. The system also features digital position detection to allow for precise positioning of the substrate and ensure precise control of the sputter process. Automegasamdri 916B is equipped with an efficient cooling unit. This machine helps to maintain sputter temperature levels to minimize particle contamination and improve the lifetime of the sputtering source. Additionally, the cooling tool can be adjusted to enable reliable processing of a wide range of substrates. Overall, TOUSIMIS Automegasamdri 916B is an excellent choice for high-performance thin film deposition applications. With its quick and precise substrate transfer asset, advanced safety systems, and efficient cooling capability, this model is well-suited for a variety of deposition processes.
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