Used ULVAC CV-200 #9251716 for sale

ULVAC CV-200 is a sputtering equipment used for a variety of thin-film deposition applications. It is primarily used for depositing thin films onto a variety of substrates in order to achieve a desired electrical, optical, or thermal characteristic. The sputtering system is highly versatile, providing plasma ionization for higher deposition rate and high particle density. The unit consists of a high-vacuum sputtering chamber, a heating and cooling machine, a rotating substrate table, and a variety of high-vacuum components such as an ion source, mass spectroscopy, and a thin-film deposition API. The sputtering chamber is equipped with four high-power magnetron sputtering sources, a powerful reversing magnetron mode for uniform film deposition, and advanced digital controls for precise control of parameters. The heating and cooling tool consists of a water-cooled ceramic heating element, Peltier cooler, and a liquid nitrogen cooling asset for rapid cooling and heating rates up to 500°C. The rotating substrate table features variable rotation speeds, rotation pause and start functions, and automatic substrate orientation for precise uniform thin-film deposition. The model utilizes advanced ion source technology that has an innovative hollow-cathode ionizer and plasma cell. An optional second ion source is also available that uses a dual source configuration that has a hollow-cathode emitter and a planar ionizer which yields higher ion and particle densities. The equipment also has a mass spectroscopy function that can analyze the active species in the sputtered depositions in order to monitor them. An advanced thin-film deposition API is also included for advanced process monitoring and control using digital signals. This allows the user to define the deposition parameters, run simulations to optimize the process, and easily maintain the ideal deposition rate and uniformity. ULVAC CV 200 is extremely easy to use and provides excellent thin-film deposition results. It offers a wide range of customizable parameters, allowing the user to adapt the system to their specific application. It is capable of high deposition rates and precise uniformity, making it the ideal choice for a variety of thin-film deposition needs.