Used ULVAC EBX 2000 #9243792 for sale

ULVAC EBX 2000 is a sputtering equipment designed for creating thin films for the purposes of development, production, and quality control. The system provides high-throughput, low-maintenance thin-film deposition, with excellent uniformity and film properties. ULVAC EBX-2000 is easy to operate and can handle a variety of materials and deposition applications. The unit features a dual-chamber design comprised of a Source Chamber and Load Lock Chamber. This design allows the machine to hold two targets simultaneously, allowing for higher throughput. The Load Lock Chamber accommodates sample handling so that the source chamber remains clean and the deposition process is kept undisturbed. The Source Chamber of EBX 2000 is made up of an ICN-type magnetron source motherboard, a plasma source, a mechanical pump, diffusion pump, and a backing pump. The ICN-type magnetron source provides the primary energy for the sputtering process. It drives the plasma and generates a highly dense energetic ion beam. This beam is then directed onto the target, causing the target material to be ejected from its surface and deposited onto the substrate. The mechanical, diffusion, and backing pumps provide a continuous suction for keeping the source chamber clean and free of contamination. EBX-2000 offers a wide range of deposition processes, from low temperatures to high temperatures. It is also capable of sputter-etching, allowing for the removal of films or thin layers from samples. The tool can achieve superior uniformity and repeatability by controlling the film thickness and target-substrate distance. Furthermore, the integrated automated recipe function makes it easy for operators to switch between recipes and processes. With ULVAC EBX 2000, users can achieve highly uniform, repeatable sputtering processes with efficient thin-film deposition. Its versatile design and user-friendly software make it ideal for both development and production applications, ensuring consistent quality and performance.