Used ULVAC EBX-2000C #9260363 for sale

Manufacturer
ULVAC
Model
EBX-2000C
ID: 9260363
Vintage: 2002
Deposition system 2002 vintage.
ULVAC EBX-2000C is a sputtering equipment designed for thin film deposition technology. It utilizes electromagnetic wave (EM) acceleration technology, which makes the ion source more efficient and faster without the need for a pressurized environment or other sources of power. The system consists of a target assembly, a source chamber, a vacuum chamber, a sputtering gun, and an optional auxiliary chamber. The target assembly allows for multiple targets to be held within a single frame, each with a different material, allowing for quick and easy switching of materials for sputtering. The source chamber is where the ion source is located, and it is connected to the sputtering gun by fluidic tubes. The vacuum chamber is used to create the necessary vacuum environment for sputtering, and can be adjusted to provide different vacuum levels for different deposition processes. The sputtering gun is where the material to be deposited is fed into the unit, and where the EM acceleration technology comes into play. Finally, the auxiliary chamber is a separate chamber that can be used for additional sputter deposition processes. In order to ensure good film deposition from ULVAC EBX 2000C, it is important to maintain proper vacuum readings, sputtering pressures, power levels, and substrate temperatures. Proper maintenance of the machine is also important to ensuring the quality of the deposition process. This includes regular cleaning of the source chamber and sputtering gun, and checking of the electrical connections. The tool also comes with a controller which can be used to program and monitor the asset operations, as well as data logging and reporting features to keep track of deposition times. Overall, EBX 2000 C is a reliable and efficient sputtering model with multiple target configurations available for thin film deposition. It provides a wide range of operating parameters to tailor the process to the desired thin film profile, and provides a reliable and repeatable deposition process when properly maintained.
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