Used ULVAC EI-5 #293690584 for sale
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ID: 293690584
Vintage: 2018
E-Beam evaporator
Batch type
Rough pump
Compressor
Evaporation source: EGL-35M EB-Gun
HEARTH 40CC
(3) HEARTH 10CC
HPS-1000N-100 Vapor deposition power supply
Deposition controller: CRTM-9200
Exhaust system:
CRYO-U16P Cryo pump
C30VR Cryo compressor
LR90 Auxiliary pump / dry pump
Vacuum gauge:
SH2-1 Ionization vacuum gauge
G-TRAN Pirani vacuum gauge
Operation system: PLC and PC control
Touch panel operation
2018 vintage.
ULVAC EI-5 is an industrial-grade sputtering system designed in Japan and manufactured by ULVAC Technologies. It features a one-piece structure with a magnetic-field generator and a highly stable vacuum chamber, making it an optimal choice for high-accuracy physical vapor deposition. EI-5 is capable of simultaneously processing two types of targets, making it highly versatile for various compound thin film production. It has a compact design, good operation flexibility, and low power consumption which is ideal for continuous operation over long hours. The magnetic field generator of ULVAC EI-5 consists of a highly efficient and durable dual rotation magnetron, a linear motor driver, and a current monitor. Through controlling the current and irradiating DC/RF power, EI-5 is able to easily and precisely control the magnetron sputtering. The maximum sputtering rate is 510 nm / min, using a single target. The vacuum chamber of ULVAC EI-5 adopts a newly designed 6-pocket cell and is equipped with a roughing valve. An active roughing system helps to enhance the vacuum stability, drastically reducing the time required to adjust the vacuum pressure. The chamber interior is also coated with a stainless steel mesh to reduce clinging material. EI-5 is highly efficient and has an impressive throughput. It is equipped with various features including an integrated PC for control and monitoring, various high accuracy sensors, and an improved process control system. It is an ideal choice for opto-electronic, flat panel display, and semiconductor production processes.
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