Used ULVAC EI-7K #9402606 for sale

ULVAC EI-7K is a sputtering equipment designed for use in thin film deposition processes. It is capable of both high precision and large substrate processing, with a uniform deposition rate over large areas. It utilises a single high current magnetron cathode, as well as two larger RF bias (RFB) electrodes, resulting in a larger range of deposition rates, from low power to high power sputtering. ULVAC EI 7 K is also equipped with a variable frequency power supply, allowing for control of deposition rate levels, for use in different sputtering processes. In addition to the RFB and magnetron cathode, EI-7K has a powerful ion beam for etching and surface modification. This ion beam helps to create uniform thin film deposition rates and a high quality surface finish. EI 7 K also offers a wide variety of process modes, including: high power sputtering, low power sputtering, multi-stack sputtering, and ion beam assisted deposition (IBAD). ULVAC EI-7K's sputter chamber is designed to be able to accommodate large substrates up to 600mm in diameter. It is also capable of accepting many kind of substrates including: quartz, silicon dioxide, aluminum oxide, and gallium nitride. The chamber has a cylindrical design with a top-load system, and is designed to reduce cost and improve efficiency by eliminating the need for manual dosing. ULVAC EI 7 K also features an independent temperature control unit, which allows for temperature control within process parameters. EI-7K sputter machine is an advanced tool for thin film deposition and etching. It features a wide range of process capabilities and features, from low power to high power sputtering, as well as a range of substrate types. Its powerful ion beam contributes to uniform thin film deposition and a high quality surface finish. Its cylindrical design, with a top-load tool, helps to reduce cost and improve efficiency. Finally, its independent temperature control asset helps to keep processes within parameters. EI 7 K is an ideal tool for thin film deposition and etching processes.