Used ULVAC Entron EX W300 #9211053 for sale

ULVAC Entron EX W300 sputtering equipment is a robust, multi-functional sputtering tool ideal for a variety of applications. The W300 provides both Argon and Oxygen (or other reactive gas) sputtering with up to four guns working simultaneously with control as fine as 1-thousandth of a millimeter precision for feature size. The high vacuum chamber can accommodate two wafers, or up to 4 inch round substrates and a nominal acceleration voltage of 500 volts. The device utilizes a Magnetron sputtering source with a power of 300 watts for Ar sputtering or 600 watts for use with reactive gases. The W300 is designed for robustness and reliability in a range of vacuum and sputtering environments including R&D, small scale production, and initial evaluation of new materials. The powerful system also offers advanced power adjustment with local pulse control, allowing for full control of process parameters. The W300 enables users to simultaneously run material deposition and surface processing, allowing for higher sample throughput and greater flexibility. In addition to ensuring process accuracy and repeatability, the W300 also features integrated semiconductor thermal processing capabilities. The unit utilizes a multi-zone quartz infrared lamp with heated radiators, providing an optimal heating temperature up to 800°C for temperaturesensitive process operations. An advanced six-axis robot machine creates multi-stage, multi-track processing routes with precise navigation and repeatable accuracy, optimizing processes such as oxide film layer removal and layer thin-film deposition. Lastly, the W300 features an intuitive user interface enabling users to quickly adapt to the tool and stay informed through the real-time, data circularization and graphical display. Built-in safety and monitoring systems protect users by automatically monitoring asset data and protecting against fault condition scenarios. Overall, ULVAC ENTRON-EX W300 is a powerful and reliable sputtering model designed to address a wide range of substrate related material processing needs.