Used ULVAC Entron EX #293627637 for sale

ULVAC Entron EX
Manufacturer
ULVAC
Model
Entron EX
ID: 293627637
Wafer Size: 12"
Sputtering system, 12" Process: BAR.
ULVAC Entron EX (Sputtering Equipment) is an advanced plasma processing equipment used for thin film deposition. Its unique design incorporates a high ion energy, low temperature sputtering, and high-vacuum within an enclosed vessel, allowing for the deposition of films with superior electrical and optical properties. ULVAC ENTRON-EX is capable of depositing films on a variety of substrates, such as glass and metal, with thicknesses of up to 1 μm. The system is easy to operate and provides flexible vacuum chamber configurations to suit a wide range of applications. Entron EX consists of two sputter sources, one anode and one cathode, and a vacuum chamber sealed with O-rings and flanges to provide a high-vacuum environment. The two sputter sources are lined up on a common axis while the substrates are placed in a substrate holder placed in the center of the half-cylinder chamber. An RF or DC power source is connected to the sputter sources in order to start the sputtering process. The sputtering process starts with a high ion source energy of approximately 200 eV, producing high-purified argon plasma, which is in contact with the metal cathode target. The metal cathode target then transfers its electrons as metal atoms and ions relatively fast to the substrate material through particles acceleration. By controlling the power from the power source, the energy of the noble gas ions can be tuned, controlling the film thickness deposition rate. ENTRON-EX provides fast deposition rate, uniform film growth, and high-quality thin film deposition, making it an ideal choice for many advanced thin film applications. The high ion energy sputtering process also allows for high ion-density plasma production and a fast deposition rate, allowing for thin film deposition without the need for rotation of the substrate. The unit allows for thin film deposition on a variety of substrates, such as glass and metal, while maintaining high-quality optical and electrical properties. The high-vacuum environment also ensures up to 1 μm resolution column density deposition with no unwanted chemical reaction. ULVAC Entron EX is an ideal thin film deposition machine for advanced thin film deposition needs due to its simple operation, flexibility, and excellent thin film deposition capabilities. Its high-ion energy low temperature sputtering, combined with high-vacuum environment make it an ideal choice for many thin film applications. With its high-quality post-deposition analysis capabilities, it can ensure superior thin film production with superior electrical and optical properties.
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