Used ULVAC Entron W 200T6 #9003925 for sale
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ID: 9003925
Wafer Size: 8"
Vintage: 2005
PVD Sputtering system, 8"
Chemical dry pre-clean chamber
Anneal chamber for chemical dry pre-clean chamber
Anneal chamber for post anneal
PVD-Ni (Ring-Ni) chamber
PVD-TiN chambers
PVD Co chambers
Includes:
Open cassette buffer station
(2) Spare shields chamber
Host communications (SECS/GEM)
S2 Safety
TiN Target
Co Target
Ni Target and backing plate
Dry pumps
Gas scrubber
Platform: NCH6000
Process specifications: CDT + Co, Ni silicide process
Front interface: Buffer station (4) ports open cassette type
Gas scrubber
Substrate size: 200 mm
Signal tower
Standard chambers layout and chamber
Platform: ENTRON NCH6000 Tandem core
With intermediate chamber isolation valve
Compatible with differential pressure transfer (FX has Ar line with needle valve)
(2) KEYTRAN4Z Vacuum robots
Double hand type with wafer pickup (A12O3)
Main pumps:
(2) SHIMADZU TMP403LM
(2) CRYO T6E RS10
(4) BOC EDWARDS Fore pumps
C30ZR Cryo compressor
(2) G-TRAN BMR2/M-13 Vacuum gauges
(2) G-TRAN BPR2/WPB-010-034 Pirani vacuum gauges
(2) Gas feed system: Gas piping for ventings (With filter)
Control system:
Operation unit: ULV100U-400 Model 17 liquid crystal display
Control system: MS-IVA
EDWARDS Dry pumps
Sputter source
Power supplies
Shielding
Targets
Manuals
2005 vintage.
ULVAC Entron W 200T6 is a highly advanced sputtering equipment designed for the advanced deposition of thin films onto substrates. This system has unique features to meet the needs of a wide variety of applications, such as thin film optics, semiconductor devices, and other micro-electronic devices. ULVAC ENTRON W-200T6 is a simple yet powerful sputtering unit. It's equipped with a 200mm capacity rectangular substrate stage, which allows for the uniform movement of the substrate during sputter coating and makes it suitable for processing large substrates. Entron W 200T6 utilizes a novel dual-gun sputtering, which allows for higher deposition rates and better uniformity of the sputtered material. Additionally, the substrate is further protected from unwanted particles and plasma deposits by employing an externally mounted magnetron sputter source during the coating process. The machine's digital control unit also offers several user-friendly options and features. It incorporates a multi-monitor display that allows the operator to keep an eye on the coating process. The user interface also offers different deposition parameters such as target composition, sputtering pressure, and gas flow. It also provides users with programmable time cycles to make the coating process easier and more efficient. ENTRON W-200T6 also employs an advanced vacuum tool to provide the necessary environment for the deposition process. This sophisticated vacuum asset includes turbo pumps with rotary vane operating in excess of 35 liters per second, and a turbomolecular pump with a pumping speed up to 15 liters per second. This combination of pumps ensures a fast evacuation process for the substrate and a precise control over the ambient pressure in the chamber. Finally, ULVAC Entron W 200T6 also offers a range of additional accessories. These accessories include a wafer loader, an exhaust port, sensors, and an array of other components. These accessories also make the model suitable for a variety of applications, from thin films for optical devices, microelectronic components, and advanced thin film battery electrodes.
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