Used ULVAC MCH-4500 #9226118 for sale

ULVAC MCH-4500 is an advanced sputtering equipment for thin film deposition purposes. It can deposit ultra-thin films on to substrates up to 4" in size. The system uses high-frequency magnetron sputtering to produce uniform films with high adhesion properties. MCH-4500 is suitable for various research and commercial applications including semiconductor, thin film electro-optical, multi-layer mirrors, and wear resistant coatings. ULVAC MCH-4500 boasts a wide range of features to maximize deposition rate and uniformity in sputtered films. The unit's high frequency magnetron power source generates up to 5kW of power, allowing for high deposition rates and uniformity in films. Furthermore, the machine incorporates a high rate sputtering deposition which allows for metal and oxide target materials to be sputtered simultaneously or separately, allowing for the production of reflective mirror layers, electrodes or saturable absorbers. The tool is outfitted with various components that ensure accurate and repeatable operation. This includes a 4-in-wafer lift unit and an automated film thickness measurement asset, which allow for precise substrate handling and monitoring for thin film deposition. MCH-4500 also features two-step mass flow controllers, two independent temperature control units, an all-in-one PC, a client/server based software control model, and a 24-7 monitoring equipment. This setup is designed to provide a reliable and automated thin film deposition experience. In addition, the system comes with a host of safety features to ensure user safety. These include a safety camera unit and an automatic safety shutter device, which protect operators from hazardous laser radiation. The safety shutter device also prevents film oxidation, while preventing particles from entering and contaminating the deposition chamber. ULVAC MCH-4500 is a highly reliable, safe and automated sputtering machine that is suitable for deposition of reliable thinner films for various applications. Its incorporation of advanced components and features allows for precise and uniform thin film deposition for a wide range of applications. The tool is an ideal choice for researchers and engineers seeking a reliable and efficient sputtering asset.