Used ULVAC MCH-9000 #9269413 for sale
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ULVAC MCH-9000 is a high-end sputtering equipment designed for use in the production of thin film coatings, nanomaterials, and other ultra-thin films. The system is composed of a main source chamber, where a slurry-coated metallic target is sputtered, as well as an ancillary chamber to support the reaction as it proceeds. To begin the sputtering process, an inert gas such as argon is fed into the main chamber, and a radio-frequency alternating current (RF-AC) is applied to the target material. This causes the monomolecular surface of the target material to break apart into free ions, which in turn become "sputter" ions that are then propelled against the surface of the substrate, forming a coating. The substrate can be a variety of materials, from glass to metal, and these coatings can be used for a wide range of applications in the semiconductor and optical industries. MCH-9000 is highly versatile, incorporating a variety of controls and features to ensure precise results. Its integrated advanced digital controller allows for exact adjustment of sputtering speed, sputter pressure, and gas flow, among other parameters. Additionally, the unit is equipped with an advanced gas circulation machine designed to reduce argon losses, as well as a vacuum pressure monitor and control tool to regulate the working environment. The asset also features an integrated monitor and recorder for diagnostic and process-control purposes. This allows the operator to track and analyze the resulting coating thickness, uniformity, and other parameters. In addition, ULVAC MCH-9000 is equipped with a range of safety systems, including overpressure shutoff switches, low-level alarms, and automatic gas shutoff valves. Overall, MCH-9000 is an advanced model designed to deliver precise, high-quality sputtering results. Its integrated process controls, diagnostic capabilities, gas circulation systems, and safety systems make it ideal for any research or production environment requiring exacting thin-film coating deposition.
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