Used ULVAC MPS-6000-C1S300 #9313940 for sale

ULVAC MPS-6000-C1S300 is a powerful yet simple to operate reactive plasma sputtering equipment. This system is designed to create thin films of metal, dielectric, and other materials on semiconductor wafers. The unit consists of three main components: an evacuation chamber, an eduction chamber, and a sputtering chamber. The evacuation chamber is used to evacuate air and other contaminants from around the sputtering chamber. This is done by employing a multi-stage turbomolecular drag pump, which uses high-speed rotating blades to draw air out of the chamber and improve chamber cleanliness. The eduction chamber is responsible for introducing small amounts of reactive gases into the sputtering chamber. This is done by employing a high-temperature resistive heating machine that serves to vaporize the reactive gases at high speed. Finally, the sputtering chamber is controlled by an onboard magnetron sputtering unit. This sputtering unit creates an electric arc between the target materials and a plasma arc generated from the cathode. This creates a controlled plasma that subsequently coats the wafers with thin films of the target materials. The tool is capable of creating films containing different materials such as metals, dielectrics, ceramic, and polymers on substrates with a variety of shapes and sizes. In addition, the asset has several safety features, such as a leakage detection model that will detect and halt any gas leaks in order to protect operators from hazardous gases. Overall, MPS-6000-C1S300 is an ideal tool for creating thin films of various materials on substrates of various shapes and sizes. The equipment's unique design and safety features make it an ideal choice for any thin film application.