Used ULVAC SBH-5218R #293754736 for sale

ULVAC SBH-5218R is a high-performance sputtering equipment designed for precise thin film deposition in a wide range of research and industrial applications. This advanced system incorporates state-of-the-art technology to enable efficient and reliable sputtering processes, making it an ideal choice for users requiring superior film quality and uniformity. The sputtering process involves the physical deposition of thin films onto a substrate by bombarding a target material with high-energy ions. SBH-5218R utilizes magnetron sputtering technology, which offers enhanced control over the deposition process compared to conventional DC sputtering systems. This technology allows for increased film adhesion, density, and uniformity, resulting in high-quality thin films suitable for various applications, such as semiconductors, optics, and magnetic storage media. One of the key features of ULVAC SBH-5218R is its multi-target configuration, which allows for simultaneous sputtering from up to four target materials. This capability enables users to deposit complex multilayer films with different compositions and properties, providing greater flexibility in material selection and film design. Additionally, the unit is equipped with a rotating substrate holder, which ensures uniform film thickness across large substrate areas and minimizes film stress and defects. SBH-5218R is also designed for ease of use and maintenance, with a user-friendly interface and intuitive software control machine. The tool includes advanced process monitoring and control features, such as real-time power measurement, gas flow regulation, and pressure control, ensuring precise and repeatable deposition results. Furthermore, the asset's automated operation and recipe management capabilities enable efficient processing of multiple samples with minimal user intervention. In terms of technical specifications, ULVAC SBH-5218R features a chamber size of 18 inches, allowing for the deposition of films on substrates up to 300 mm in diameter. The model operates at a maximum power of 3 kW and can achieve deposition rates of up to 5 nm/min, depending on the target material and process conditions. The equipment is also equipped with a range of optional features, such as in-situ substrate heating, substrate biasing, and film thickness monitoring, to further enhance its capabilities and flexibility. Overall, SBH-5218R is a powerful and versatile sputtering system that offers users a combination of advanced technology, reliable performance, and ease of use. With its multi-target configuration, precise process control, and high deposition rates, this unit is well-suited for a wide range of thin film deposition applications in research, development, and production environments. Whether used for thin film coating, material characterization, or device fabrication, ULVAC SBH-5218R delivers superior results and exceptional reliability for demanding sputtering processes.