Used ULVAC SCH-135 #293623445 for sale

ULVAC SCH-135 is a sputtering equipment designed and manufactured by ULVAC Technologies Inc. It offers film sputtering and plasma cleaning processes used to deposit thin films on substrates or to clean surfaces in the semiconductor industry. This system utilizes high frequency power to sputter target material onto the substrate. It accomplishes this by creating a low-pressure environment, applying a high vacuum, arranging a strong magnetic field, and introducing a gas. SCH-135 sputtering unit has four major components. The first component is the main chamber, which contains a stainless steel chamber, vacuum flanges for attaching other components, and a target material. The second component is the substrate holder which is made of polypropylene, has flat alignment blocks and can handle up to six substrates. The third component is the RF power supply which has a capability of supplying up to 5 kW of RF power for sputtering. The fourth component is the pulse DC power supply, which is also used for sputtering. The process of sputtering begins with a high vacuum being created in the main chamber. This is done by introducing a gas into the chamber and using a vacuum pump to facilitate the reaction. Once the desired high vacuum is achieved, the next step is to arrange a strong magnetic field in the main chamber. This is accomplished by using a three-axis magnetic field configuration. After the magnetic field is set, the RF power supply is used to apply a large electric field near the substrate. This field ionizes the gas molecules which burst and release an ionic species that bombard and bond with the target material. As these particles fall onto the substrate they become the thin film coating. Finally, the sputtered material is also cleaned with an oxygen plasma. A vacuum environment is first established and the pulse DC power supply is then used to create an oxygen plasma. The plasma is then sprayed onto the sputtered film and surface of the substrate to remove particles, debris, dust, and residual gases, and to improve adhesion. Overall, ULVAC SCH-135 is a highly efficient sputtering machine used to deposit thin film coatings on substrates or to clean surfaces. It utilizes a variety of components to create high vacuums, arrange strong magnetic fields, and apply the necessary power sources for the sputtering process. Following the sputtering process, an oxygen plasma is utilized to clean the sputtered film and substrate surface.