Used ULVAC SCH-135A #9162023 for sale
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ID: 9162023
Vintage: 2010
Horizontal inline sputtering system
Deposit: ZnO + Ag + Ti Films on glass substrates
Substrate size: 1100 mm x 1400 mm x 3~5 mm
Tact time: 80 Sec per substrate
System configuration:
Loading chamber
Heating chamber
Sputtering chamber 1 (4 Cathode for ZnO)
Intermediate isolation chamber
Sputtering chamber 2 (3 Cathode for Ag, Ti)
Isolation chamber
Unloading chamber
Vacuum chamber assembly
Transfer assembly
Internal jig assembly
Heating assembly
Sputtering cathode assembly
Power supply assembly
Frame / Conveyor assembly
Pumping system
Operation system
Measurement system
Gas inlet system
Compressed air system
Cooling water system
Spare parts
Substrate conditions
Substrate type: Soda-lime glass substrate coated with amorphous silicon film
Substrate size: 1100 (±1.5) x 1400 (+1.5) x 3t, 4t, 5t (mm)
Processing capacity:
Tact time: 1.3 Min per substrate (80 sec per substrate)
Vacuum conditions:
Ultimate pressure:
Heating
Sputtering
Isolation chambers
8.0 x 10 Pa/better
Evacuation time: Loading / Unloading chambers
Sputtering conditions:
Cathode type:
σ Cathode for ZnO deposition
σ Cathode for Ag deposition
σ Cathode for Ti deposition
Target type:
ZnO
Ag
Ti
Target dimensions:
ZnO: W 200 x L 1620x T61B (mm)
Ag: W 200 x L 1650 x T23/33 (mm)
Ti: W 200 x L 1650 x T61B (mm)
Film thickness / Film thickness uniformity:
ZnO: 80 nm± 10%
Ag: 210 nm± 10%
Ti: 15 nm± 10%
Heating condition:
Case1:
Right before ZnO cathode: 80° C ± 15° C or below (Sub.thickness: 4t)
Right before Ag cathode: 80° C ± 15° C or below (Sub.thickness: 4t)
Case2:
Right before ZnO cathode: 120° C ± 15° C or below (Sub.thickness: 4t)
Right before Ag cathode: 120° C ± 15° C or below (Sub.thickness: 4t)
Transfer speed approximately: 833 mm/min
Uptime: ≥ 85%
MTBF: ≥ 192 Hours
MTTR: < 7.7 Hours
Power: 10 kW, DC power
2010 vintage.
ULVAC SCH-135A is a sputter deposition equipment designed for production of thin films, coatings, and protective layers. It incorporates the use of ion-gun sputtering technology to produce high-end specialty films, enabling the deposition of films with superior adhesion and superior compatibility with substrates. SCH-135A system is a highly configurable unit well-suited for research and production of films with atomic-level precision. Its core components include an Ion Gun, a Sputter Gun, a Vacuum Pump and a Substrate Transfer Machine. The Ion Gun is designed to generate high-energy ions which are steered onto a metal-coated cathode surface of the sputter gun. The metal-coated cathode is bombarded by the ions, causing sputtering of atoms from the metal-coated cathode. These films are deposited onto the substrate in a uniform manner by the chamber's RF-source power supply. The Sputter Gun is equipped with an adjustable magnetic field, allowing fine-tuning of the sputtering process. This adjustable magnetic field helps minimize ion backscatter and minimize ion energy losses on the substrate's surface. The CH-135A tool also includes a large substrate holder, capable of holding large substrates of up to 500mm in diameter. The vacuum pump acquires and maintains the vacuum pressure within the deposition chamber. The vacuum rating of the asset is of 10 5 Pascal and the pressure is continuously monitored and adjusted to optimize the deposition process. ULVAC SCH-135A also features a fully automated substrate transfer model designed to enable safe transfer of substrates between the substrate holder and the deposition chamber, eliminating the need to manually transfer substrates Overall, SCH-135A form ULVAC is a high-end sputtering equipment, designed for controlled and consistent deposition of thin films with superior adhesion and compatibility. Its core components, including the ion gun, sputter gun, vacuum pump, and substrate holder provide users with a high level of control and precision over the sputtering process.
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