Used ULVAC SIH-4545 #9055116 for sale

ULVAC SIH-4545 is a sputtering equipment used in the deposition of thin film coatings from a wide range of targets. The system is comprised of an ultra-high vacuum chamber, a heating element for the substrate, a powerful RF power supply, and a sputter gun. Using an accelerated gas, such as Ar, Ar/O2, or Ar/N2, the sputter gun delivers a high-power beam of ions to the target, causing sputtering, or the release of atoms, onto the target. This bombardment of ions provides uniform deposition of the target material onto the substrate. The ultra-high vacuum (UHV) chamber is designed to provide a base pressure level in the range of 1.0x10-10 Pa to 10-3 Pa. It is comprised of a 2-stage roughing pump connected to a gate valve and a turbomolecular pumping unit. The HI Speed Roughing Pump provides a deep vacuum level in the range of 75 to 110 Pa while the Turbo Molecular Pump provides a higher vacuum in the range of a few mPa. This, combined with the chamber's metal seals and bake operation, allows for a very clean processing environment. The heating element, typically a high-power IR lamp, provides precise control of the substrate temperature during processing, allowing for consistent and repeatable results. The radio frequency (RF) power supply in SIH-4545 provides reliable and stable power throughout the sputtering process. The stable RF power level, combined with the rapid processing speed, makes the sputtering machine ideal for large, complex substrate surfaces. The sputter gun in ULVAC SIH-4545 provides an adjustable ion source. It is designed to generate high-power, short-range impinging ions, thus allowing for fast and uniform coating deposition onto the substrate surface. The sputter gun is adjustable for diameter of the ion plasma produced, allowing for precise control of the coating thickness applied. The ion source can be configured for either DC or RF operation, with the DC option suitable for low sensitivity substrates such as glass, and the RF option for more sensitive substrates such as silicon wafers. SIH-4545 provides a precise, repeatable and flexible sputtering tool for producing thin film coatings on a range of materials. The adjustable ion source, combined with the precise substrate heating element and the ultra-high vacuum chamber, provides a controlled and clean processing environment that allows for repeatable and uniform deposition of the target material onto the substrate surface.