Used ULVAC SMD-2400C #293755343 for sale

ULVAC SMD-2400C is a revolutionary sputtering equipment that boasts a wide range of features for applications in semiconductor and electronics industries. Developed by Unisys-Unigraphics, SMD-2400C offers top-of-the-line performance with an ionization rate of over 400nm per minute. It is a highly efficient sputtering tool that is ideal for the production of thin film metallization layers on the surface of electrically insulating materials. ULVAC SMD-2400C features a number of advanced features, such as its integrated 8" magnetron substrate source, multiple power supplies, and deposition chamber monitoring. The integrated magnetron substrate source features a low impedance design, meaning that it is capable of achieving higher deposition rates with improved accuracy and stability. Additionally, SMD-2400C has three separate power supplies that can be independently controlled, allowing the operator to choose the sputtering current and the target substrate temperature. In addition to its hardware setup, ULVAC SMD-2400C is supported by a reliable set of software and control systems that can be manipulated to optimize the sputtering process. It uses a digital pulse-width modulation system to provide the operator with precise control over the sputtering process, allowing them to adjust the pulse width and deposition rate in real-time. The unit also features a high-speed plasma contactless monitoring unit, meaning that the operator can quickly evaluate the overall shape and uniformity of the metallization layer. In terms of performance, SMD-2400C has an impressive ionization rate of up to 400nm per minute, allowing for the simultaneous deposition of both high-rate and thin film materials. It also has an adjustable chamber pressure of up to 2.4 x 10-4 Pa mbar, making it capable of delivering high-quality deposition rates for the production of a wide range of materials. Overall, ULVAC SMD-2400C is an excellent choice for the production of high-quality thin film metallization layers. Its integrated 8" magnetron substrate source, multiple power supplies, and chamber monitoring capabilities make it a reliable and efficient sputtering tool. Its digital pulse-width modulation machine also enables the operator to precisely control the sputtering process, while its high-speed plasma monitoring unit ensures the uniformity of the metallization layers. Altogether, these features make SMD-2400C a great choice for any thin-film metallization needs.