Used ULVAC SME-200 #9293517 for sale

ULVAC SME-200 sputtering equipment is designed for high-performance thin film deposition applications at an industry-leading low cost of ownership. It provides a low vacuum, rapid sputtering process with excellent uniformity, repeatability, and controllability. ULVAC SME 200 is equipped with two separate target holders, one of which is a sputtering target with a PBN (Pyrolytic Boron Nitride) dielectric. This enables the system to deposit both metallic and dielectric films. The dielectric has extremely low sputtering yield that minimizes the risk of sputtering particles onto previous layers of thin film. In addition, both targets can be used simultaneously to deposit metals and dielectrics in a single operation, or alternately for added deposition speed. SME-200 also features a load-lock chamber and a heated substrate holder that can hold up to four 4-inch wafer samples. This allows for rapid sample loading and unloading under vacuum. The heater has a range of 0°C to 400°C, ideal for thermal processing of the wafers. The unit has high deposition rate capability with repeatable recipe-based deposition process control. It is also equipped with a QMS-200 (Quality Monitoring Machine) that automatically monitors target conditions and provides datalogging and quality control functions. SME 200 is a powerful sputtering tool that can handle a wide range of applications from protective layers and barrier layers to planarization layers. ULVAC also offers a number of other sputter asset models in the SME series for various sputtering requirements.