Used ULVAC SME-200J #293597222 for sale

ULVAC SME-200J is a top-of-the-line sputtering equipment designed for use in industries such as semiconductor, micro-electronics, hard disk media and components, optoelectronics, and optical devices. It is an automated sputtering system featuring an advanced deposition chamber, efficient load-lock chamber, and precise control. ULVAC SME 200 J has an effective rectangular shape deposition chamber that allows for uniform distribution of particles and improved material deposition accuracy. As a result, parts are well-deposited with consistent and repeatable film thickness. The interior also features high cleanliness, which minimizes contamination and helps produce parts with precise vapor deposition. The integrated load-lock chamber of SME-200J quickly and precisely loads and unloads parts (6" × 6" or 8"×8"). The chamber has an adjustable pressure, up to five steps, enabling smooth and precise loading and unloading of parts. Moreover, the chamber is gas-tight, preventing contamination and unwanted particulates. SME 200 J has precise control features that increase process stability, including closed-loop feedback control and onscreen menu-driven programming. This also allows for precise thickness control of deposited films over a range of 150 Å-3500Å with an accuracy of 1 Å. The deposition parameters can also be programmed for automation and soft segmentation, further enhancing programmable sophistication. Additionally, ULVAC SME-200J has various safety installations that ensure safety of personnel and equipment. The unit is equipped with a pressure sensor, emergency protection devices for abnormal operations, a reinforced vacuum lid, and pre-vacuum venting doors. This provides a high level of operator protection and allows seamless and safe operation, even in harsh environments. Overall, ULVAC SME 200 J is an all-in-one sputtering machine designed to meet the most demanding applications in industries such as semiconductor, micro-electronics, hard disk media and components, optoelectronics, and optical devices. It features a high-precision deposition chamber and efficient load-lock chamber with precise control features, ensuring high material deposition accuracy, consistent and repeatable film thickness, and safe operation.