Used ULVAC SME-200J #9266438 for sale

ULVAC SME-200J sputtering equipment is a versatile system designed for various metallization processes in thin film deposition. It is composed of an RF power supply to produce the sputter plasma, along with a chamber that houses the process. The unit can handle a wide variety of targets and gases, providing a broad range of sputtering techniques. ULVAC SME 200 J sputtering chamber utilizes a planar magnetron with two sets of magnets arranged perpendicular to the target, allowing for control of the plasma density. This machine is also capable of rotation of the magnets to optimize the uniformity of the sputtered material. The chamber includes two 40 cm targets, a target feed-through, a gas feed-through, and a vacuum port for evacuation of the chamber. There is also a special venting arrangement for reducing contamination risk. For controlling the sputtering process, the tool is equipped with a programmable interface. The operator can set process parameters and sequence of operations. Parameters such as target current, pressure, gas control, and plasma conditions can be set and monitored. This interface also allows for the storing of recipes and monitoring of plasma measurement. SME-200J processes large areas of substrates with uniform coating of films. It is built with an emergency stop, temperature monitor, and security asset. It is compatible with a variety of types of substrate, including aluminum, stainless steel, quartz, and plastics. The sputtering model is ideal for thin film deposition processes such as LCD panel and solar cell production. SME 200 J sputtering equipment is a powerful and versatile thin film deposition device. With its adjustable parameters, large sputter area, and wide range of sputtering techniques, ULVAC SME-200J is an effective tool for many thin film processes.