Used UNAXIS / BALZERS LLS 502 #9214650 for sale
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ID: 9214650
Vintage: 1996
Sputtering system
Environmental conditions:
Out of operation:
Temperature: 10-50°C
Relative humidity: 30-80%
During operation:
Temperature: 18-30°C
Relative humidity: 40-60%
Facilities requirement:
Argon-process: 0.5-1.0 Bar
CDA: 6-8 Bar / 87-116 PSI
N2 Vent: 1.5-2.5 Bar / 21.7-29.0 PSI
N2 Regen (Purge): 1.5-2.5 Bar / 21.7-36.3 PSI
PCW:
Inlet pressure: 4-7 Bar / 58-101 PSI
Outlet pressure: <0.5 Bar
Temperature: 15-25°C
(2) CTI On-Board 8F Cryo pumps
POLYCOLD (Meissener) PFC-400LT Chiller
Temperature range: -120°C to -150°C
Power supply: 415 V
Max full load amp: 8.00 A
PFEIFFER DUO 65 Mechanical pump
PFEIFFER DUO 035D Mechanical pump
(2) Pinnacle power supplies
Output power: 15 kW
IONTECH MPS-5001 Beam current controller
MSU 200 (A 250.1) Power distribution unit
Magnetron (Target-cathode): Ti, Al, Cu, GE, AU
Unit mass flow controller (UFC):
MFC 1: 50cc Ar
MFC 2: 20cc Ar
Chambers:
Load lock chamber (LC): Argon cleaning chamber
Main chamber (MC): Deposition chamber
Vacuum state:
Current MC base pressure: 1.70E-08
Current LC base pressure: 9.30E-08
Current MC ROR: 7.30E-07
Current LC ROR: 1.10E-07
Electrical power:
Supply voltage: 3 x 400 / 230 V (3L + N + PE)
Supply frequency: 50 Hz and 60 Hz
Main ground: <2 Ohm
1996 vintage.
UNAXIS / BALZERS LLS 502 is a sputtering equipment designed for a variety of thin-film applications. The system features a five-inch diameter target holder, a six-inch cathode, and a load-lock unit for efficient substrate loading and unloading. The maximum substrate size is 6" x 4.75". The machine runs at a maximum plasma power of 360 watts with high uniformity and low plasma non-uniformity. The load-lock tool continuously monitors pressure, temperature, and speed for precise sample loading and unloading. The target manipulation asset provides highly accurate target control and allows for maximum target utilization. The model's PECVD module provides a wide range of process parameters. Its process chamber features a single-piece belljar with an optically accessible viewport. It is capable of maintaining precise chamber temperatures, pressures, and gases over a wide range of low to medium temperatures. The equipment also features a sputter module which is capable of processing both thin and thick films. It features a three-zone process chamber, a three-inch inner diameter stainless steel cylindrical vacuum chamber, a four-zone magnetron, and a three-zone fast-stopping motion system. The uniformity and homogeneity of sputtered films can be attained with the magnetization unit, which provides magnetic field profile control and allows for uniform sputtering of substrates up to 6" in size. The machine's process control features a Windows-based operator interface designed for seamless tool integration. It features a secure remote access asset that allows access to the model from anywhere with an Internet connection. The equipment also features powerful process control features including batch recipes, multiple process profiles, and variable power control. Overall, UNAXIS LLS 502 is a high-precision sputtering system suitable for a wide range of thin-film applications. It features a five-inch diameter target holder, a six-inch cathode, and a load-lock unit for efficient substrate loading and unloading. Its PECVD, sputter, and process control modules provide a wide range of processing capabilities for an array of thin-film applications.
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