Used UNAXIS Clusterline 200 #9189483 for sale

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ID: 9189483
Vintage: 2000
Sputtering system Turbo pumps: TMH 521P (2) TMH 520 TMH 260 Brooks robot and arm-set PN: 201600-01R Brooks load lock-drive/controller PN: 003-9010-03 Turbo pumps and controllers: (3) TCP 380, DCU300 ARQ and magnet-system (Al-chamber) PN: ARQ 151 D31, MB300DR magnets Load-lock with cass system, 6" Transfer camber turbo pump Sputter etch chamber with turbo pump Sputter chamber Heated lamp Rotation magnets with turbo pump Magnetron has rotation magnets Sputtering of ALU and ALU nitride Dual arm robot Robot included Spare parts: O-Ring Metal rings Ceramic chamber Transport brackets 2000 vintage.
UNAXIS Clusterline 200 is a sputtering equipment that offers precision film deposition technology for a variety of substrates, including glass, ceramic, plastic and metal substrates. This versatile system is designed for flexibility and production on medium to large-scale jobs. It offers an automated process control feature that produces uniform and high-quality thin film deposition on substrates. Clusterline 200 uses a high quality manufacturing process that begins with the preparation of the substrate. The substrate is then transported through the unit in a vacuum chamber where a UNAXIS magnetron source generates highly focused energy beams. As these beams bombard the substrate, they cause particles to be sputtered from the source and form a thin film on the target substrate. To ensure the best possible results, the process is continuously monitored by the automated process control feature. UNAXIS Clusterline 200 also provides an integrated process monitoring platform that ensures a reliable, efficient, and controlled work process. The integrated process monitoring platform allows users to monitor machine parameters, diagnose any issues that arise and adjust the process for optimal performance. Moreover, Clusterline 200 delivers superior performance with its advanced sputtering technology. Its advanced sputtering technology uses an innovative pressure pulse technology to limit the amount of ionized atoms that are generated. This helps to reduce surface roughness and crystal growth, while also allowing for thin layer deposition on small and complex parts. Finally, UNAXIS Clusterline 200 can accommodate various substrate temperatures and pressures to maximize process efficiency. This helps to minimize film loading on substrates and minimize residual stress. In conclusion, Clusterline 200 is a powerful, high-performance sputter deposition tool that offers versatility, precision and robust process control. Its advanced process control and cutting-edge technology make it ideal for deposition on a variety of substrates.
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