Used VACUUM SYSTEMS TECHNOLOGY / VST TFSP-840 #293602592 for sale
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ID: 293602592
Sputtering system
Ultimate vacuum pressure: 3x10^-7 Torr
Base pressure: 1x10^5 Torr
Pirani gauge, 100 to 1x10^-5 Torr
Maximum allowable leak rate: <1x10^-9 mbar L/sec (Helium)
Vacuum pumping system
PLC Controlled power switching boxes
DC Blocked filters
Substrate holder
PLC / PC Computer control
Targets:
Titanium Tungsten: (Ti) 10 (W) 90 %
Copper (Cu)
Silicon Nitride (Si3N4)
Sputtering mode:
DC / DC Pulsed
RF
Combination of RF and DC
Chamber:
High grade stainless steel, water cooled, SS 304L
3-Ports
RF Shielded view port, 4"
Pumping port
Load lock chamber:
Loading sample holder, Up to 6"
EDWARDS nXDS10 Dry pump:
Pressure: 8x10^-3 Torr
Nominal pumping speed: 10 m³/hrs
EDWARDS EXT75iDX Turbo molecular pump:
Pumping speed: 61 L/sec
Compression ratio N2: >1x10^11
Ultimate pressure: 5x10^-8 mbar
Nominal rotational speed: 90,000 rpm
Air cooling
Sputtering sources:
Source dimension: MAK, 4"
Mounting feedthrough: Quick coupler, 0.75"
Target specifications:
Target diameter: 4"
Target mounting: Magnetic
Magnetic materials
Magnet design:
Type: Nd/Fe B
Configuration: Balanced/Unbalanced
Operation specifications:
DC Max power: 3000W
RF Max power: 1200W
Cathode voltage (Volts): 200-1000V
Discharge current (Max amps): 7 amp
Cooling water:
Flow rate 1.0 gpm
Vacuum interlock
High voltage switch
Chamber switch
Load-lock switch
Dry air pressure switch
Water flow switches
Substrate temperature
Emergency stop
Electrical overload protection
Gas line:
Gas / MFC
Ar / 1-100 SCCM
N2 / 1-50 SCCM
O2 / 1 – 50 SCCM
Maximum beam current:
25 to 35% of discharge current
280mA (Ar @ 1A)
350mA (O2 @ 1A)
Beam energy (Mean): 50 to 180eV (~60% of Anode voltage set point)
Max discharge power: 300W (200W Continuous)
Discharge voltage range:
Ar: 50 to 300V
O2: 100 to 300V
Discharge current range: 0.2 to 1A (Mark I + Ion Source Controller)
Max operating pressure: 1 x 10^-3 Torr (0.13Pa)
Gas use: Inert Gases, O2, N2 and other reactive gases
Typical gas flow range: 2-20sccm
Ion beam neutralization: Filament cathode
Ion beam size (at opening): 1.1 in (28mm) Diameter
MFC 20 sccm
Power supply:
RF Power supply: 13.56 MHz, 600 W
DC Power supply: 1500 W.
VACUUM SYSTEMS TECHNOLOGY / VST TFSP-840 is a versatile sputtering equipment that delivers robust and consistent sputtering performance. The system is equipped with several chamber configurations and can accommodate a variety of tools and accessories. The unit is capable of processing both thin and flexible substrates, allowing for reliable and repeatable deposition on a variety of materials. VST TFSP-840 utilizes a state-of-the-art two chamber design with an isolated loading chamber and a separate process chamber. The loading chamber is designed to reduce particle contamination and allow for quick, easy sample loading. Each chamber is equipped with a 2" roughing pump to create a stable, low-pressure environment and ensure efficient operation. The loading chamber utilizes a load-lock door to minimize airborne contaminants and ensure smooth operation. In the process chamber, VACUUM SYSTEMS TECHNOLOGY TFSP-840 is equipped with eight cathodes and a powered substrate rotation mechanism. Each cathode can independently adjust power settings and sputtering targets. The high-performance substrate rotation mechanism provides consistent and even deposition over the entire substrate. The top-mounted sputter gun allows the machine to be easily containerised for in-situ processing of large area samples. The TSFSP-840 is equipped with a range of accessories, including retrofitted substrates holders, external substrate heating, roller transport tool, onboard lift/direct access arm and safety lock that ensures safe and uninterrupted operation. The added features make the TSFSP-840 an ideal candidate for industrial applications. Thanks to its extensive features, the TFSFP-840 provides consistent and repeatable results, ensuring reliable thin-film deposition on a variety of substrates. The asset offers precise process control and reliably repeatable performance, making it well-suited for high throughput applications. Moreover, the model's user-friendly touchscreen interface allows for simple and convenient operation.
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