Used VARIAN 3125 #38005 for sale

VARIAN 3125 Ion Source Sputter Equipment is a laboratory-scale sputtering system used in the surface coating of substrates using inert or reactive gases. It is capable of etching, depositing, and alloying materials of low or high atomic weight to the substrate. 3125 is a high-quality, cost-effective solution for laboratory sputter coating applications and can be used for small-scale production in a variety of sputter-based experiments. VARIAN 3125 features an ion energy controller for precise and accurate energy adjustment. It also has a large cathode area and a powerful rotary magnetron sputtering gun. This gun allows the movement of the substrate in any direction, thus providing a complete and homogeneous coverage of the target. Additionally, 3125 has a vacuum pressure of 10-2 mBar and a pumping time of ~10 minutes. The unit is composed of several components, including a high-vacuum pumping module, a cryopump, and a vacuum metering station with manual override control machine. Furthermore, the unit has an air-cooled power supply, with both adjustable negative and positive bias. Additionally, VARIAN 3125 features a manual control tool, with the capability for the operator to customize the sputter process parameters. The versatile 3125 is suitable for both DC and RF sputtering processes. It is also capable of sputtering from a wide range of metals, nitrides, oxides, and alloys. The asset allows for the sputtering of rotatable target substrates, including ceramics, glass, and rigid wax substrates, as well as flexible and non-flat substrates. Various parameters are available for the user to customize their sputter process, including DC/RF power levels, rates, time, and cooling parameters. VARIAN 3125 also allows samples to be magnetically rotated during the process. This rotation enhances the uniformity of the deposition. 3125 Ion Source Sputter Model is an effective, user-friendly solution for laboratory and small-scale production sputter coating applications. It allows the user to customize their process to fit their specific requirements. Its optimization and stability allow it to be used reliably in a variety of sputtering applications.