Used VARIAN 3180 / 3190 #9009369 for sale

VARIAN 3180 / 3190 is a highly efficient and reliable sputtering equipment designed for high-precision applications such as microelectronics and thin films. The system is capable of producing high-purity, low-temperature and high-rate deposition of a wide range of surfaces and materials. The sputter sources are easy to operate and provide excellent control over the deposition process. The unit also features a high-temperature capability allowing for crystal growth and selection of different deposition modes. 3180 / 3190 offers a 60 cm diameter chamber that accommodates up to 4 sputter sources. The chamber features a temperature range of up to 600°C and a pressure of 10-7 torr. A forced-air recirculation machine is incorporated in the chamber that maintains a uniform environment for precise deposition. The chamber also incorporates an in-situ process control tool which monitors the atmospheric environment to detect any process-induced changes. The sputter sources, which are available in 8" and 6" diameters, work with substrates up to 12" in size. Each sputter source is equipped with a magnetron source that fires argon ions at the target material in order to form a protective layer of material on the substrate. The sources are also designed for high-rate uniform deposition, as well as a variety of additional process capabilities. The asset also includes process control software, which enables custom process recipes to be created and modified as needed. This allows for precise and repeatable deposition of metals, alloys, and other materials. It also allows for high-efficiency use of your sputtering sources by creating and monitoring the deposition process. VARIAN 3180 / 3190 is a reliable and highly efficient model for deposition and sputtering applications. The equipment's powerful sputter sources, in-situ process control system, and process control software enable the precise and repeatable deposition of a variety of materials with high accuracy. This unit provides excellent control over the deposition process and is ideal for applications such as microelectronics and thin films.