Used VARIAN 3180 #9131926 for sale

Manufacturer
VARIAN
Model
3180
ID: 9131926
Wafer Size: 4"
Sputtering system, 4".
VARIAN 3180 sputtering equipment is a versatile tool for metal, alloy, and insulating thin-film deposition. It utilizes capacitively coupled magnetron sputtering and is equipped with independent process control of up to three magnetrons for uniform and discrete film growth. Its 3-axis robotic automation grants full sample access from the substrate size up to 8 inches. 3180 system can be controlled either manually or with a computer to deposit various materials. The unit provides a dual-chamber design for an RF power supply and sputter gun assembly. It utilizes RF energy up to 3.0 kW which allows the deposition of very thick films. VARIAN 3180 also has an unlimited choice of mixtures and independent sputter rates for making multilayer structures. The advanced process control technology includes a gas blending machine for reactive sputtering. Its highly precise pressure control further ensures uniform and fast media delivery. 3180 is capable of bulk deposition as well as patterned deposition. It allows fine-tuned control of the apertures by a digitally programmable attachment. It has an integrated pre-cleaning facility to provide better specimen surface conditions for depositing. The Vacuum Interlock Tool enables pressure regulation and vacuum sensing. VARIAN 3180 also has an on-board power failure asset in case of emergency. 3180 has many advantages, such as excellent film uniformity, excellent step coverage enhanced by built-in film dewetting and smooth film profiles. Its robust construction ensures years of durable performance, and its precise control allows you to deposit very resistant film layers. The operating model is user-friendly and provides accurate feedback on the state of the equipment and the film deposition process. It also features versatile data logging capabilities, allowing users to monitor the progress of a sputtering process. In conclusion, VARIAN 3180 sputtering system is a powerful tool for thin film deposition, with its advanced process control technology and versatile design. It features excellent film uniformity, durability, and a user-friendly interface, making it appealing for users in the nanotechnology industry and other related fields.
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