Used VARIAN 3280 #154113 for sale
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ID: 154113
Wafer Size: 6"
Vintage: 1985
Sputtering system, 6"
Sources: (1) Mini Quantum, (1) CMI, (1) CMII
Specifications:
Dedicated 6" wafer handling capability
Throughput: 45 wafer/hour for 1-micron aluminum alloy depositions
Film thickness uniformity:
± 5% across 6" wafer for aluminum alloys, excluding outer 0.0625" of wafer
± 5% wafer to wafer and cassette to cassette for aluminum alloys, when measured at the wafer center
Vacuum system:
Process chamber:
VARIAN Cryostack-12FA closed-loop helium cryopump
12" diameter pumping stack with integral fixed aperture
Load lock:
Pumped initially with 27 cfm direct drive mechanical pump to a pre-selected pressure
When pressure set-point is reached, crossover to the cryopump occurs for continued load lock pumping
Process chamber base pressure: 5 x 10^-7 Torr
Deposition source:
Type: DC dual cathode conical magnetron with independently powered cathodes
Orientation: horizontally mounted sideways sputtering
Typical deposition rates:
Aluminum alloys: 10,500 Angstroms/min
Refractory metal silicides: 3,600 Angstroms/min
Cathodes:
Outer: 9.7" diameter
Inner: 5.4" diameter
Cathode life: 3000 1-micron aluminum alloy depositions/cathode set
Deposition power supply:
(2) Power supplies provided for each sputter deposition source
Operating range:
12kW maximum for outer cathode
3kW maximum for inner cathode
Cathode power ratios: 4 ratios can be selected to optimize uniformity throughout cathode life
Maximum cathode output current: 23A
Open circuit voltage: 1400V
Substrate heaters:
Type: gas conduction, resistive heater element
Maximum temperature: 400°C
Temperature control: Chromel-alumel thermocouple closed-loop feedback to EUROTHERM temperature controller
Facilities requirements:
Electrical power:
Main system:
200/208V, 35A, 50/60Hz, 3-phase
380V, 20A, 50/60Hz, 3-phase
480V, 16A, 50/60Hz, 3-phase
Power supplies:
380V, 140A, 50/60Hz, 3-phase
480V, 112A, 50/60Hz, 3-phase
Air: 80 to 120 psi at 10 cfm
Water: 8 gpm at ≤ 20°C
Dry nitrogen: 5 L/min at 20 psi
Argon: 2 Torr-liters/sec
1985 vintage.
VARIAN 3280 is a sputtering equipment that can produce thin films of various materials, such as metals, semiconductors, and dielectrics. The system utilizes reactive and non-reactive sputtering to coat substrates in a range of thin film configurations, and it is capable of delivering precise and consistent results. The sputtering unit operates in a vacuum and can produce thin, uniform films over large area substrates. The machine has a user-friendly control, allowing for full parameter control and enabling users to adjust sputtering features for custom thin film deposition processes. The tool provides precise power adjustments and a highly repeatable film thickness to allow for maximum control. 3280 utilizes a magnetron sputtering process, which enables high apposition rates, superior thin film qualities, and the ability to control Film Deposition Room environments in a cost-effective manner. The asset includes a magnetron power supply and a control circuitry that enables the control of sputtering rate. By using an Auto-sputtering process, users can program in different parameters of pressure, deposition rate, gas mixtures, and substrate positions. The model offers an unparalleled level of accuracy and repeatability, and its coating uniformity ensures the highest level of thin film product quality. Furthermore, the equipment is easy to upgrade, allowing users to obtain superior sputtering performance with minimal cost. VARIAN 3280 is the ultimate sputtering system for thin film deposition, and is ideal for applications that require precise thin film deposition. The unit is compact, reliable, and affordable, allowing users to get the sputtering results they need in an efficient and cost-effective manner.
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