Used VARIAN 3290 STQ #9154643 for sale

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Manufacturer
VARIAN
Model
3290 STQ
ID: 9154643
Wafer Size: 6"
Sputtering system, 6" Entity target configuration: Process station #2: ALSICU Process station cathode configuration: Station #2: Quantum (Rotating magnet) Heater configuration: Heater type (All station): DC BIAS Heater controller (All station): (1) Eurotherm 808, (2) Eurotherm 3508 Power supply configuration: Outer PSU station #2: AE PINNACLE 12 KW Outer PSU station #3: AE PINNACLE 12 KW Outer PSU station #4: AE PINNACLE 12 KW System vacuum configuration: Compressor: Model 9600 8R Cryo pump: Yes Water pump: No Software configuration: User's guide: ECS 3000 Version: 96.204.10U1 Floppy drive: 3.5" Double cassette loading: Yes.
VARIAN 3290 STQ sputtering equipment is an advanced deposition system that offers advanced process capabilities. It is designed to provide reliable, repeatable performance and high-quality thin films to meet the most stringent requirements for various applications. The unit comes equipped with a robust, polyvalent chamber, an intuitive and flexible software interface, and a variety of sputtering targets and substrates. The chamber of VARIAN 3290STQ is used to control the deposition process, is designed to achieve a high degree of repeatability and accuracy while providing superior process control and reliability. The chamber features a bell-jar configuration, which provides excellent access to the deposition area and allows for rapid substrate loading and unloading. A choice of either magnetron or diode sputtering sources is available to deposit thin films of a variety of metals. In addition, a wide range of substrate sizes and shapes can be used with the machine, including wafers, substrates, and any other irregular shapes. The robust software interface of 3290 STQ has been designed to enable easy and intuitive control over the deposition process. All aspects of tool optimization, such as material parameters, the power setting, and other parameters related to the deposition process can be configured to meet specific requirements. The asset also features automated recipe scripting, which simplifies the optimization process and ensures consistent results. Unique, adaptive process control algorithms are also included in the model to provide a higher level of process control and reduce process variability. The equipment also offers ramping capabilities, which allow for a stepped deposition approach from low to high power settings while monitoring the reaction process. 3290STQ system comes with a variety of sputtering targets and substrates to meet the most demanding requirements. VARIAN can provide a choice of standard or custom high-purity, high-density targets, with or without lifetime warranties. Substrates include quartz, ceramic, and sapphire wafers, as well as other substrates for applications requiring special performance characteristics. Overall, VARIAN 3290 STQ provides advanced sputtering systems capabilities and features, and delivers reliable, repeatable performance and high-quality thin films. Its intuitive interface and wide range of sputtering targets and substrates enable users to achieve process optimization while controlling process variability.
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