Used VARIAN 3290 STQ #9293265 for sale

VARIAN 3290 STQ is a sputtering equipment designed for durable and reliable deposition of thin films and multilayers. This system provides excellent process repeatability and uniformity to meet tight control requirements with an exceptional degree of stability. It offers an advanced pulsed power supply unit with three power levels that provide a range of voltages, currents, and pulse frequencies for optimal sputtering performance. The machine is further equipped with two large volume target assemblies and two planar electrostatic clamps for secure and precise sample handling. VARIAN 3290STQ utilizes an advanced process control tool to deliver precise and repeatable sputter rates with no need for manual adjustments. This control asset offers intuitive software to control process parameters, such as target power and substrate bias. The large-sized targets allow for efficient sputtering of layers up to 5" wide and the ability to continuously vary power for trends and uniformity control. The model is also fully compatible with a wide range of materials, including dielectrics and conductors, and features a protection equipment that prevents back-etching and target runaway. 3290 STQ sputtering system accommodates a variety of substrate shapes and sizes and also includes an in-situ sputter-etch mode. This unit features fast substrate loading and unloading times, superior chamber cleanliness, and short pumpdown times. Furthermore, the machine includes an automated water vapor-sensing tool to provide a clean, break-free film structure and a universal rotatable remote plasma source that can be used for oxygen-based cleaning and etching applications. The asset also features a low-load capacity model and is ideal for magnetic media applications or for depositing high-performance films. Overall, 3290STQ is an advanced automated sputtering deposition equipment designed to provide precise and repeatable thin film results. With its intuitive process control software and efficient large volume target assemblies, the system ensures optimal sputtering performance and offers superior chamber cleanliness and fast substrates loading times. The unit further includes a universal rotatable remote plasma source for oxygen-based cleaning and etching applications, and a low-load capacity machine suitable for more demanding applications.