Used VARIAN 3290 #9075492 for sale

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Manufacturer
VARIAN
Model
3290
ID: 9075492
Wafer Size: 6"
Sputtering system, 6" (3) Target assemblies: Conmag II Station 1: Heated etch with AE RF-10 power supplies Station 2: Heater table with conmag II Station 3: Heater table with conmag II Station 4: Heater table with conmag II (4) Temperature controllers: Eurotherm 818 Controller: Fluke 1722A modified with flash drive and floppy drive Multimeter: HP 3438A Ferrofluidic transfer plate feedthru grade (3) Ferrofluidic shutter feedtrhu upgrades Ion gauge controller: Varian 880 Remote power supply panel Digital readout Etch matching unit controller with digital readout meters RF RWD and REFL remote meter panel Cryo pump: CTI CT-8 with SC compressor Dry scroll mechanical pump: no Power supplies: Target 1: Inner 2.5kW, outer 12kW Target 2: Inner 2.5kW, outer 12kW Target 3: Inner 2.5kW, outer 12kW Currently warehoused 1989 vintage.
VARIAN 3290 sputtering system is a high performance equipment used for thin film deposition processes. Its' primary purpose is to deposit thin films of metals, oxides and semiconductors onto a range of substrates for a variety of applications. 3290 uses a high level of process control and a large range of capabilities to produce high-quality thin films for integrated circuits, flat panel display, MEMS and solar cell applications. It achieves this through its three distinct and independent parameters: a cathode, an adjustable platen, and adjustable flux-sources. The cathode is the source of the material to be deposited onto the substrate. This is typically a wire such as aluminum, palladium or gold, but other inert materials like chromium may also be utilized. The wire is sputtered onto the substrate, which can be placed on the adjustable platen. The adjustable platen can control the angle of the substrate and the rotation for a uniform deposition on the substrate. The adjustable flux sources provide a uniform shielding from any ions that may disrupt the deposition process. The flux sources also offer some level of background neutralization, by providing electrons to the platen. VARIAN 3290 also has a wide range of customizable deposition parameters, allowing users to deposit a variety of materials in a variety of thicknesses. These parameters offer a great level of flexibility in the selection of deposition speed, voltage, substrate temperature and gas flow rates. 3290 sputtering system is reliable and highly efficient, offering excellent film quality with high repeatability and reproducibility. Its large range of capabilities and process parameters give users the control they need to produce the desired results. Its user friendly interface and complex set up protocols make it an ideal choice for any thin-film deposition process.
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