Used VARIAN 3290 #9154647 for sale

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Manufacturer
VARIAN
Model
3290
ID: 9154647
Wafer Size: 6"
Sputtering system, 6" Entity target configuration: Process station #1: HARD ETCH Process station #2: ALSI Process station #3: ALSI Process station #4: ALSI Process station cathode configuration: Station #1: Etch Station #2: Con-Mag 2 Station #3: Con-Mag 2 Station #4: Con-Mag 2 Heater configuration: Heater type (All Station): DC BIAS Heater controller(AII Station): (3) Eurotherm 808, (1) Eurotherm 3508 Power supply configuration: RF Gen. station #1: RF-10S (1KW max) Inner PSU station #2: 2.5 KW Outer PSU station #2: AE PINNACLE 12 KW Inner PSU station #3: 2.5 KW Outer PSU station #3: AE PINNACLE 12 KW Inner PSU station #4: 2.5 KW Outer PSU station #4: AE PINNACLE 12 KW System vacuum configuration: Compressor: Model 8150 8R Cryo pump: Yes Water pump: No Software configuration: User's guide: ECS 3000 Version: 96.204.10U1 Floppy drive: 3.5" Double cassette loading: Yes.
VARIAN 3290 is an precision high-power DC sputtering equipment manufactured by VARIAN, a major supplier of scientific and laboratory equipment. The system is designed to create layers of thin materials onto substrates such as disks, wafers, and tubes. It enables the precise deposition of thin films for a variety of applications, ranging from semiconductor devices to decorative products. The unit includes a variety of accessories for sputtering various materials, including stainless steel, aluminum, other metals, ceramic and oxide films. 3290 features direct current (DC) sputtering technology, a nanoscale deposition technique. The technique utilizes a controlled, low-pressure environment inside a vacuum chamber, allowing the bombardment of a sputtering target with electrons to create a thin film on the substrate. This bombardment leads to the ejection of thin film atoms from the target material, which then deposit onto the substrate. This technology is highly precise, allowing for the deposition of uniform layers of various substances on the substrate material. VARIAN 3290 has a maximum power output of 5.4kW and three independent cathodes. This allows for quick deposition of multiple layer stack structures, a valuable feature for complex multi-layered applications. The tension range can be adjusted from 0v to 5kV to adjust the sputtering process. The machine also features active cooling systems, which allow the user to adjust power delivery even with the high-power output, preventing overheating during extended usage. Additionally, the tool has an automatic pressure-sensing asset that constantly monitors and adjusts the chamber pressure. 3290 is an advanced model that provides a range of features not found on other systems, and allows for the precise deposition of thin films and uniform layer structures. Combined with its robust construction and durable components, VARIAN 3290 provides an excellent solution for a wide range of thin-film deposition projects.
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