Used VARIAN 3290 #9154648 for sale

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Manufacturer
VARIAN
Model
3290
ID: 9154648
Wafer Size: 6"
Sputtering system, 6" Entity target configuration: Process station #1: HARD ETCH Process station #2: ALSI Process station #3: ALSI Process station #4: ALSI Process station cathode configuration: Station #1: Etch Station #2: Con-Mag 2 Station #3: Con-Mag 2 Station #4: Con-Mag 2 Heater configuration: Heater type (All Station): DC BIAS Heater controller (All Station): (3) Eurotherm 808, (1) Eurotherm 3508 Power supply configuration: RF Gen. station #1: RF-10S (1KW max) Inner PSU station #2: 2.5 KW Outer PSU station #2: AE PINNACLE 12 KW Inner PSU station #3: 2.5 KW Outer PSU station #3: AE PINNACLE 12 KW Inner PSU station #4: 2.5 KW Outer PSU station #4: AE PINNACLE 12 KW System vacuum configuration: Compressor: Model 8150 8R Cryo pump: Yes Water pump: No Software configuration: User's guide: ECS 3000 Version: 96.204.10U1 Floppy drive: 3.5" Double cassette loading: Yes.
VARIAN 3290 sputtering equipment is an advanced, multi-component deposition tool used to create thin films. At the core of the system is the magnetron sputtering component, which uses a magnetically-shielded cathode with a concentric arrangement of coils. This creates a strong magnetic field near the cathode surface that directs the emission of electrons towards the sputtering target, allowing for a very uniform, often high-yield deposition process. The unit is equipped with several components and features which enable the deposition of different substances. For example, the cathode's shape can be adjusted with an adjustable configuration platform to create an optimized radius-of-deposition. Additionally, the sputtering target material can be programed to be optimized for maximum sticking efficiency and even tailored for specific application needs. 3290 is equipped with three main components for high-rate deposition of thin films. The first is a dual-magnetron sputter gun, which provides two highly efficient deposition zones. The second is an induction coil, which prevents arcing and is connected to a power supply to heat the sputtering target before sputtering. Finally, the third component is a chamber-screening mechanism to control the ions within the chamber, enhancing the deposition rate. VARIAN 3290 utilizes a computer-pilot interface for easy control and customization of the machine. This enables accurate control of pressure, frequency, voltage, and temperature, allowing users to optimize the deposition process. Furthermore, the advanced diagnostics subsystem can detect certain electrical or mechanical malfunctions and alert the user immediately. Overall, 3290 is a powerful, multi-purpose sputtering tool designed to deposit high-yields of thin films. Its variable configuration platform, dual-magnetron gun, unique chamber-screening mechanism, and precise computer-pilot interface make it an ideal choice for a variety of sputtering applications.
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