Used VARIAN 3290 #9161097 for sale

VARIAN 3290 is an sputtering equipment that utilizes ionized gas molecules, primarily inert gases such as argon, to bombard the surface of a substrate in order to deposit thin films of material. This process, commonly used in the fabrication of semiconductor devices, is known as sputtering. 3290 consists of four main components: the sputtering chamber, the power supply, the controller, and the load-lock. The sputtering chamber is the large cylindrical container in which the sputtering process takes place. Inside is the substrate, typically a silicon wafer, which is mounted in a vacuum chuck. The chamber is filled with inert gas molecules, most often argon, and a high-voltage potential is placed across the substrate and chamber walls. The gas molecules are then ionized by the electric field and accelerated towards the substrate, where they bombard it and dislodge material from the surface. This material then deposits onto the substrate, creating a thin film. The power supply provides the energy for the sputtering process. It consists of a high voltage power source, typically in the several kilovolt range, along with an ammeter and voltmeter which are used to precisely control the power levels required for the sputtering process. The controller is the "brain" of the system, controlling the various functions of the sputtering process. It is typically a computer or a specialized control board that sends commands to the power supply to adjust the voltage levels, and communicates with the vacuum chamber controller to regulate the pressures, gases, and temperatures inside the sputtering chamber. The load-lock, as the name implies, is used to "lock in" the substrate to the vacuum chamber, ensuring that it is securely mounted in place during the sputtering process. VARIAN 3290 has a highly advanced load-lock unit that is designed to rapidly ramp up the pressure inside the chamber while minimizing thermal shock to the substrate and maintaining a consistent vacuum environment. In conclusion, 3290 is an advanced sputtering machine designed to deposit thin film materials on substrates with both high precision and reliability. It utilizes a high-voltage potential to ionize and accelerate inert gas molecules towards a target surface, depositing material in a highly-controlled manner. Advanced features such as its high-precision power supply and load-lock tool ensure that the sputtering process is carried out with minimal thermal shock and consistent deposition.