Used VARIAN 3290 #9236342 for sale

VARIAN 3290 is an advanced sputtering equipment manufactured by VARIAN Semiconductor Equipment Associates, Inc. The system is designed for a variety of applications, including the creation of thin films, production of compound semiconductor devices, and microfabrication. 3290 offers a number of unique features, such as its patented magnetron sputtering technology, which increases sputtering rates and produces layers of thin films with improved uniformity and adhesion. The unit also features an integrated plasma etch capability, with programmable process variables and end-point detection, to further increase process control. This plasma etch process can be used to produce narrow trenches and fine features. In addition, VARIAN 3290 has a high deposition rate, thanks to its broad range of power supplies. It can accommodate a wide range of chamber sizes, from 6-inch up to 14-inch, with up to four sputter sources. With the adjustable tilt feature, the sputter sources can be aimed precisely at the substrate. The machine also has a fast substrate heating capability,with an integrated thermocouple and PID control, allowing temperature control down to 25°C. 3290 also has an advanced computer-based process control tool, which helps simplify process development and yield optimization by allowing the operator to access real-time process data and trend analysis. A digital laser interferometer asset is also integrated, to measure and monitor gross thickness alignment and uniformity, while also providing precise control of end-point thickness and layer thicknesses to high accuracy at the nanometer level. The model is also equipped with a wide range of safety features. It has two-level user authentication, intruder monitoring, a fire alarm equipment, temperature overload protection, and ESD/EMI protection. In addition, VARIAN 3290 system has been designed to meet FDA standards to ensure an exceptionally safe and productive working environment. In summary, 3290 sputtering unit is an advanced solution designed with a wide range of features to help improve production capabilities and increase process control. Its innovative magnetron sputtering process, integrated plasma etch capability, various chamber sizes, adjustable tilt feature, fast substrate heating, advanced process control machine, and laser interferometer tool make it an ideal choice for a wide variety of applications.