Used VARIAN 3290 #9236359 for sale

VARIAN 3290 is an advanced sputtering equipment designed for the deposition of thin films for semiconductor and photonics applications. This sputtering system consists of a vacuum deposition chamber, a high-voltage power supply, and a deposit cassette. The unit enables the deposition of conductive or semiconductive materials with high uniformity and excellent uniformity. The vacuum deposition chamber in 3290 is designed to maintain a high degree of control over materials and environment. It includes a large, stainless steel chamber equipped with a positive pressure differential sensing machine to ensure that there is no contamination present in the chamber. The deposition cassette is designed to be easily loaded and unloaded, and the tool includes a variety of sputtering targets and accessories. VARIAN 3290 is equipped with a high voltage power supply to create the necessary plasma field for the sputtering process. The sputtering chamber is designed to handle both DC and pulsed power supply. The power supply is designed for reliable operation and precise control of the sputtering process. The power supply is also equipped with a variety of safety features to ensure the safety of operators and to protect essential asset components from potential hazards. 3290 also comes with a deposit cassette for efficient loading and unloading of the deposition material. It is designed to be used with low pressure or cryogenic sputtering, which allows for the deposition of thin layers of materials with even thicker layers of protective layers. The deposit cassette is designed to provide the operator with an efficient way to control the distribution of materials during the deposition process. To ensure the highest quality finish, VARIAN 3290 comes with a computer-controlled panel that automatically monitors and adjusts a variety of parameters throughout the deposition process, including the growth rate and power supply settings. The model also features a variety of temperature and gas sensors designed to provide the operator with real-time information about the chamber's environment. Overall, 3290 is an advanced sputtering equipment designed for the deposition of thin-film materials with even thick layers of protective layers. It is equipped with a range of innovative features that allow for precise control of the thin-film deposition process and a high degree of accuracy. In addition, it is designed with safety in mind to protect essential system components from potential hazards.