Used VARIAN 3290 #9238015 for sale

VARIAN 3290 is a sputtering equipment that can produce thin film materials using magnetically enhanced reactive sputtering (MERS) or reactive ion beam etching (RIBE) technology. The system is capable of producing a wide range of materials such as metals, dielectrics, oxides, semiconductors, and thin films. This sputtering unit is designed to provide superior uniformity and reproducibility for deposition of these materials for various applications. 3290 is a three-source sputtering machine that offers high ion currents (>200mA) for improved deposition rates compared to traditional sputter sources. The tool includes a powerful and highly efficient dual cold cathode source, which enables high rate deposition of a variety of materials. This Cathode Angle Deposition (CAD) sputtering source is designed for depositing high purity, thin layers of materials with uniformity across large surface areas. The asset also features a high-performance electro-magnetic multi-target sputter source, enabling deposition of highly sophisticated layered structures with excellent uniformity and reproducibility. The sputter model utilizes an advanced vacuum equipment for efficient and consistent deposition operation. VARIAN 3290 uses advanced technologies that ensure excellent vacuum performance including RF and DC pumping systems, a regenerative Turbo pump with a separately mounted ion gauge and water-jet pump, as well as a broad spectrum of getter pumps for continuous surfactant-free substrates. 3290 also offers the advantage of process capability and flexibility in terms of material deposition rates and uniformity. The powerful source system employed by VARIAN 3290 enables it to deposit thin layers of a wide variety of materials with greater uniformity than traditional technologies. The unit is capable of substrate temperatures ranging from room temperature up to 350°C and up to 10 W/cm2 average deposition power, providing a highly flexible process for many materials. 3290 machine is also ideal for direct deposition of both metals and dielectric. In addition to DC/RF sputtering, the tool is capable of reactive sputtering, chemical vapor deposition (CVD) and chemical reactive ion beam etching (RIBE). The asset offers a wide variety of ancillary process capabilities such as rotary target, bias sputter and surface processing such as MERSTEC. The advanced features and capabilities of VARIAN 3290 make it ideal for a wide variety of thin film deposition applications and processes. With its high deposition rates, uniformity, and process flexibility, the VARIAM 3290 is a highly effective model for producing thin film materials.