Used VARIAN 3290 #9258444 for sale

VARIAN 3290 is a highly advanced sputtering equipment designed for use in semiconductor wafer processing that is capable of producing uniform thickness deposits with high industry-standard yields. It features a dual sputter-head chamber and a sophisticated computer control system that allows for precision control of the deposition process. The unit is powered by a thyratron-driven power supply with a programmable output range of between 0-4000 watts, providing the operator with the ability to create highly consistent thin film deposits with precise control of deposition rate. The power supply also features high thermal efficiency, allowing for faster cycling times, thus making more efficient use of the sputtering machine. 3290 is equipped with a 50 mm telescope-style platen that allows for loading and unloading wafers. The platen is specifically designed for use with 8-inch wafers and 4-inch wafers, facilitating a variety of different substrate sizes and shapes. It also features a convenient vacuum-hopper which allows for easy loading of the substrate with pre-determined amounts of material for the sputtering process. The turret-style dual-head chamber is capable of producing uniform deposits with dynamic control of the sputter pressure, ensuring consistency of the thin film deposition on the substrate. The tool also features iQuartz sputter technology, which utilizes two opposing electrodes to create a plasma chamber for enhanced sputter uniformity. The deposition rate is controlled through a mechanical shutter, enabling the operator to precisely control the sputtering process. VARIAN 3290 also features a sophisticated computer control asset for further precision and accuracy. This allows the operator to set parameters for the sputtering rate, deposition temperature, pressure, and other critical process variables that enable the maximum uniformity of the layer being deposited. In conclusion, 3290 is one of the most advanced and reliable sputtering systems on the market. Its dual-head chamber, advanced control model, power supply, and telescope-style platen give operators the ability to produce consistent, uniform thin-film deposits at high yields. This equipment is ideal for semiconductor wafer processing operations that require reliability, uniformity, and accuracy.